{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,6]],"date-time":"2024-09-06T08:41:22Z","timestamp":1725612082036},"reference-count":10,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2009,10]]},"DOI":"10.1109\/socc.2009.5335661","type":"proceedings-article","created":{"date-parts":[[2009,11,20]],"date-time":"2009-11-20T13:33:15Z","timestamp":1258723995000},"page":"128-131","source":"Crossref","is-referenced-by-count":1,"title":["Performance analysis of multi-channel memories in mobile devices"],"prefix":"10.1109","author":[{"given":"Jari","family":"Nikara","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Eero","family":"Aho","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Petri A.","family":"Tuominen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kimmo","family":"Kuusilinna","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"journal-title":"JEDEC Standard - Low Power Double Data Rate 2 (LPDDR2)","year":"2009","key":"3"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1145\/1201775.882347"},{"key":"10","article-title":"3D Integration - Opportunities, Challenges and Industry Readiness - Perspectives from Design, Manufacturing and EDA","author":"marchal","year":"2009","journal-title":"Tutorial Notes Design Automation and Test in Europe Conference"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2009.5090799"},{"journal-title":"High Performance Memories New Architecture DRAMs and SRAMs Evolution and Function","year":"2000","author":"prince","key":"7"},{"year":"0","key":"6"},{"journal-title":"Memory System Power","year":"0","author":"micron","key":"5"},{"year":"0","key":"4"},{"key":"9","first-page":"63","article-title":"Trends in assembling of advanced IC packages","author":"kisiel","year":"2005","journal-title":"Journal Telecomm and Inform Technol"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/TPDS.2006.75"}],"event":{"name":"2009 International Symposium on System-on-Chip - SOC","start":{"date-parts":[[2009,10,5]]},"location":"Tampere, Finland","end":{"date-parts":[[2009,10,7]]}},"container-title":["2009 International Symposium on System-on-Chip"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5314285\/5335650\/05335661.pdf?arnumber=5335661","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,18]],"date-time":"2017-03-18T18:47:38Z","timestamp":1489862858000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5335661\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,10]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/socc.2009.5335661","relation":{},"subject":[],"published":{"date-parts":[[2009,10]]}}}