{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,8]],"date-time":"2024-09-08T03:29:04Z","timestamp":1725766144637},"reference-count":8,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2012,9]]},"DOI":"10.1109\/socc.2012.6398338","type":"proceedings-article","created":{"date-parts":[[2013,1,7]],"date-time":"2013-01-07T19:13:06Z","timestamp":1357585986000},"page":"370-375","source":"Crossref","is-referenced-by-count":3,"title":["On-chip self-calibrated process-temperature sensor for TSV 3D integration"],"prefix":"10.1109","author":[{"given":"Tzu-Ting","family":"Chiang","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Po-Tsang","family":"Huang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ching-Te","family":"Chuang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kuan-Neng","family":"Chen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jin-Chern","family":"Chiou","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kuo-Hua","family":"Chen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chi-Tsung","family":"Chiu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ho-Ming","family":"Tong","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wei","family":"Hwang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2010.5703479"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2007.4418976"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2008.2007462"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2011.2109971"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/SOCC.2010.5784737"},{"key":"5","first-page":"208","article-title":"A CMOS temperature sensor with a voltage-calibrated inaccuracy of \ufffd0.15\ufffdC (3?) from ?55 to 125\ufffdC","author":"souri","year":"2012","journal-title":"IEEE International Solid-State Circuits Conference"},{"key":"4","first-page":"186","article-title":"Accurate characterization of random process variations using a robust low-voltage highsensitivity sensor featuring replica-bias circuit","author":"meterelliyoz","year":"2010","journal-title":"IEEE International Solid-State Circuits Conference"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2009.5280879"}],"event":{"name":"2012 IEEE 25th International SOC Conference (SOCC)","start":{"date-parts":[[2012,9,12]]},"location":"Niagara Falls, NY, USA","end":{"date-parts":[[2012,9,14]]}},"container-title":["2012 IEEE International SOC Conference"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/6387373\/6398324\/06398338.pdf?arnumber=6398338","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,22]],"date-time":"2017-03-22T18:35:21Z","timestamp":1490207721000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6398338\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012,9]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/socc.2012.6398338","relation":{},"subject":[],"published":{"date-parts":[[2012,9]]}}}