{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,9,29]],"date-time":"2025-09-29T12:01:01Z","timestamp":1759147261336,"version":"3.28.0"},"reference-count":19,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,9]]},"DOI":"10.1109\/socc.2013.6749680","type":"proceedings-article","created":{"date-parts":[[2014,3,7]],"date-time":"2014-03-07T21:04:09Z","timestamp":1394226249000},"page":"153-158","source":"Crossref","is-referenced-by-count":2,"title":["High-level TSV resource sharing and optimization for TSV based 3D IC designs"],"prefix":"10.1109","author":[{"given":"Byunghyun","family":"Lee","sequence":"first","affiliation":[]},{"given":"Taewhan","family":"Kim","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"19","first-page":"483","article-title":"A multilevel multilayer partitioning algorithm for three dimensional integrated circuits","author":"hu","year":"2010","journal-title":"Proc IEEE International Symposium on Quality Electronic Design"},{"key":"17","first-page":"330","article-title":"MediaBench: A tool for evaluating and synthesizing multimedia and communications systems","author":"lee","year":"1997","journal-title":"Proc IEEE\/ACM International Symposium on Microarchitecture"},{"key":"18","first-page":"435","article-title":"Compatibility path based binding algorithm for interconnect reduction in high-level synthesis","author":"kim","year":"2007","journal-title":"Proc IEEE\/ACM International Confernece on Computer-Aided Design"},{"key":"15","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.1986.1270207"},{"key":"16","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2006.870076"},{"key":"13","first-page":"590","article-title":"3D-STAF: Scalable temperature and leakage aware floorplanning for three-dimensional integrated circuits","author":"zhou","year":"2007","journal-title":"Proc IEEE\/ACM International Confernece on Computer-Aided Design"},{"key":"14","doi-asserted-by":"publisher","DOI":"10.1109\/SOCC.2011.6085124"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2009.4796507"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2004.1382591"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1145\/1572471.1572486"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1145\/1837274.1837476"},{"key":"1","first-page":"674","article-title":"A study of throughsilicon-via impact on the 3D stacked IC layou","author":"kim","year":"2009","journal-title":"Proc IEEE\/ACM International Confernece on Computer-Aided Design"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2010.2050012"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2011.5770702"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2009.4810285"},{"key":"5","first-page":"191","article-title":"Parametric yield management for 3D ICs: Models and strategies for improvement","volume":"4","author":"ferri","year":"2010","journal-title":"ACM Journal on Emerging Technologies in Computing Systems"},{"key":"4","first-page":"166","article-title":"TSV redundancy: Architecture and design issues in 3D IC","author":"hsieh","year":"2010","journal-title":"Proc IEEE\/ACM Design Automation and Test in Europe"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/SOCCON.2009.5398032"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2010.5490828"}],"event":{"name":"2013 IEEE 26th International SoC Conference (SOCC)","start":{"date-parts":[[2013,9,4]]},"location":"Erlangen, Germany","end":{"date-parts":[[2013,9,6]]}},"container-title":["2013 IEEE International SOC Conference"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6745905\/6749643\/06749680.pdf?arnumber=6749680","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,23]],"date-time":"2017-03-23T21:43:16Z","timestamp":1490305396000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6749680\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,9]]},"references-count":19,"URL":"https:\/\/doi.org\/10.1109\/socc.2013.6749680","relation":{},"subject":[],"published":{"date-parts":[[2013,9]]}}}