{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,30]],"date-time":"2024-10-30T14:22:13Z","timestamp":1730298133908,"version":"3.28.0"},"reference-count":19,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,9]]},"DOI":"10.1109\/socc.2013.6749687","type":"proceedings-article","created":{"date-parts":[[2014,3,7]],"date-time":"2014-03-07T21:04:09Z","timestamp":1394226249000},"page":"197-202","source":"Crossref","is-referenced-by-count":0,"title":["Morpack Cube: A portable 3D heterogeneous system integration platform"],"prefix":"10.1109","author":[{"given":"Chun-Chieh","family":"Chiu","sequence":"first","affiliation":[]},{"given":"Chih-Hsing","family":"Lin","sequence":"additional","affiliation":[]},{"given":"Chih-Chyau","family":"Yang","sequence":"additional","affiliation":[]},{"given":"Yi-Jun","family":"Liu","sequence":"additional","affiliation":[]},{"given":"Ssu-Ying","family":"Chen","sequence":"additional","affiliation":[]},{"given":"Jin-Ju","family":"Chue","sequence":"additional","affiliation":[]},{"given":"Chih-Ting","family":"Kuo","sequence":"additional","affiliation":[]},{"given":"Gang-Neng","family":"Sung","sequence":"additional","affiliation":[]},{"given":"Chun-Pin","family":"Lin","sequence":"additional","affiliation":[]},{"given":"Chien-Ming","family":"Wu","sequence":"additional","affiliation":[]},{"given":"Chun-Ming","family":"Huang","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"19","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2010.2094183"},{"key":"17","doi-asserted-by":"publisher","DOI":"10.1109\/ISSE.2011.6053953"},{"key":"18","article-title":"Optical ?ber accelerometer system for structural dynamic monitoring","volume":"9","author":"antunes","year":"2009","journal-title":"JEEE Sensors Journal"},{"year":"0","key":"15"},{"year":"0","key":"16"},{"year":"0","key":"13"},{"year":"0","key":"14"},{"year":"0","key":"11"},{"year":"0","key":"12"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2006.878259"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2010.2051732"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/ICICDT.2007.4299568"},{"year":"0","key":"10"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/ISSOC.2005.1595649"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/POLYTR.2001.973276"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2009.2021734"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2002.1008278"},{"key":"9","first-page":"64","article-title":"3D packaging: W here all technologies come together","author":"karnezos","year":"2004","journal-title":"TEEEICPMTISemi Tnt Electron ManuJact Symp"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/SOCC.2012.6398375"}],"event":{"name":"2013 IEEE 26th International SoC Conference (SOCC)","start":{"date-parts":[[2013,9,4]]},"location":"Erlangen, Germany","end":{"date-parts":[[2013,9,6]]}},"container-title":["2013 IEEE International SOC Conference"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6745905\/6749643\/06749687.pdf?arnumber=6749687","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,23]],"date-time":"2017-03-23T21:43:17Z","timestamp":1490305397000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6749687\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,9]]},"references-count":19,"URL":"https:\/\/doi.org\/10.1109\/socc.2013.6749687","relation":{},"subject":[],"published":{"date-parts":[[2013,9]]}}}