{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,23]],"date-time":"2024-10-23T00:29:42Z","timestamp":1729643382968,"version":"3.28.0"},"reference-count":8,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,9]]},"DOI":"10.1109\/socc.2015.7406991","type":"proceedings-article","created":{"date-parts":[[2016,3,27]],"date-time":"2016-03-27T22:08:48Z","timestamp":1459116528000},"page":"396-400","source":"Crossref","is-referenced-by-count":3,"title":["Research on crosstalk issue of through silicon via for 3D integration"],"prefix":"10.1109","author":[{"given":"Ting","family":"Kang","sequence":"first","affiliation":[]},{"given":"Zhaowen","family":"Yan","sequence":"additional","affiliation":[]},{"given":"Wei","family":"Zhang","sequence":"additional","affiliation":[]},{"given":"Jianwei","family":"Wang","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISEMC.2011.6038277"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2011.5770714"},{"key":"ref6","doi-asserted-by":"crossref","DOI":"10.1109\/TCPMT.2010.2101892","article-title":"Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring","volume":"1","author":"cho","year":"2011","journal-title":"IEEE Trans Components Packaging and Manufacturing Technology"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2009.5074148"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/EPEPS.2010.5642538"},{"journal-title":"Analytical Numerical- and Measurement-Based Methods for Extracting the Electrical Parameters of Through Silicon Vias (TSVs)[J]","year":"2014","author":"ndip","key":"ref7"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/EPEPS.2009.5338469"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2008.4550025"}],"event":{"name":"2015 28th IEEE International System-on-Chip Conference (SOCC)","start":{"date-parts":[[2015,9,8]]},"location":"Beijing, China","end":{"date-parts":[[2015,9,11]]}},"container-title":["2015 28th IEEE International System-on-Chip Conference (SOCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7363404\/7406870\/07406991.pdf?arnumber=7406991","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,9,5]],"date-time":"2019-09-05T20:56:17Z","timestamp":1567716977000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7406991\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,9]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/socc.2015.7406991","relation":{},"subject":[],"published":{"date-parts":[[2015,9]]}}}