{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,21]],"date-time":"2025-08-21T18:42:49Z","timestamp":1755801769053,"version":"3.44.0"},"reference-count":13,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,9,1]],"date-time":"2019-09-01T00:00:00Z","timestamp":1567296000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,9,1]],"date-time":"2019-09-01T00:00:00Z","timestamp":1567296000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,9]]},"DOI":"10.1109\/socc46988.2019.1570537232","type":"proceedings-article","created":{"date-parts":[[2020,5,7]],"date-time":"2020-05-07T21:27:28Z","timestamp":1588886848000},"page":"155-160","source":"Crossref","is-referenced-by-count":0,"title":["Group Delay Compensation By Combining 3-tap FFE With CTLE for 80Gbps-PAM4 Optical Transmitter"],"prefix":"10.1109","author":[{"given":"Jiquan","family":"Li","sequence":"first","affiliation":[{"name":"Institute of RF and OE-ICs, Southeast University,Nanjing,Jiangsu,P. R. China,210096"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yingmei","family":"Chen","sequence":"additional","affiliation":[{"name":"Institute of RF and OE-ICs, Southeast University,Nanjing,Jiangsu,P. R. China,210096"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhen","family":"Zhang","sequence":"additional","affiliation":[{"name":"Institute of RF and OE-ICs, Southeast University,Nanjing,Jiangsu,P. R. China,210096"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hui","family":"Wang","sequence":"additional","affiliation":[{"name":"Institute of RF and OE-ICs, Southeast University,Nanjing,Jiangsu,P. R. China,210096"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chao","family":"Guo","sequence":"additional","affiliation":[{"name":"Institute of RF and OE-ICs, Southeast University,Nanjing,Jiangsu,P. R. China,210096"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Binbin","family":"Yang","sequence":"additional","affiliation":[{"name":"Institute of RF and OE-ICs, Southeast University,Nanjing,Jiangsu,P. R. China,210096"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/PRIME.2016.7519508"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1049\/el.2017.1167"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2584641"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1049\/iet-cds.2014.0240"},{"key":"ref4","first-page":"153","article-title":"A 40Gb\/s VCSELOver-Driving IC with Group-Delay Tunable Pre-Emphasis for Optical Interconnection","author":"tsunoda","year":"2014","journal-title":"IEEE International Solid-State Circuits Conference"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/LPT.2014.2385671"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/LPT.2018.2841841"},{"key":"ref5","first-page":"1178","volume":"23","author":"chen","year":"2015","journal-title":"4-channel 35Gbit\/s Parallel CMOS LDD Electronic letters"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JLT.2016.2600591"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/LPT.2014.2372041"},{"key":"ref2","doi-asserted-by":"crossref","first-page":"802","DOI":"10.1109\/JLT.2014.2363848","article-title":"A 50 Gb\/s NRZ Modulated 850 nm VCSEL Transmitter Operating Error Free to 90 °C","volume":"33","author":"schow","year":"2015","journal-title":"Journal of Lightwave Technology"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2717918"},{"key":"ref9","article-title":"90 Gbit\/s 4-level PulseAmplitude-Modulation Vertical-Cavity SurfaceEmitting Laser Driver Integrated Circuit in 130 nm SiGe Technology","author":"belfiore","year":"2017","journal-title":"IEEE MTT-S Latin Amer Microw Conf"}],"event":{"name":"2019 32nd IEEE International System-on-Chip Conference (SOCC)","start":{"date-parts":[[2019,9,3]]},"location":"Singapore","end":{"date-parts":[[2019,9,6]]}},"container-title":["2019 32nd IEEE International System-on-Chip Conference (SOCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9083732\/9087941\/09088104.pdf?arnumber=9088104","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,8,20]],"date-time":"2025-08-20T18:40:00Z","timestamp":1755715200000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9088104\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,9]]},"references-count":13,"URL":"https:\/\/doi.org\/10.1109\/socc46988.2019.1570537232","relation":{},"subject":[],"published":{"date-parts":[[2019,9]]}}}