{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,29]],"date-time":"2025-08-29T10:10:45Z","timestamp":1756462245279,"version":"3.28.0"},"reference-count":10,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,9,5]],"date-time":"2023-09-05T00:00:00Z","timestamp":1693872000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,9,5]],"date-time":"2023-09-05T00:00:00Z","timestamp":1693872000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,9,5]]},"DOI":"10.1109\/socc58585.2023.10256816","type":"proceedings-article","created":{"date-parts":[[2023,9,22]],"date-time":"2023-09-22T17:45:42Z","timestamp":1695404742000},"page":"1-6","source":"Crossref","is-referenced-by-count":1,"title":["Pin Accessibility Improvement with Hit-Point Distribution Metrics for Sub-4nm Standard Cell"],"prefix":"10.1109","author":[{"given":"Jaeha","family":"Lee","sequence":"first","affiliation":[{"name":"Samsung Electronics,Foundry Division,Hwaseong-si,Gyeonggi-do,Korea,18448"}]},{"given":"Seungmin","family":"Lee","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Foundry Division,Hwaseong-si,Gyeonggi-do,Korea,18448"}]},{"given":"Hyeongkyu","family":"Kim","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Foundry Division,Hwaseong-si,Gyeonggi-do,Korea,18448"}]},{"given":"Taejun","family":"Yoo","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Foundry Division,Hwaseong-si,Gyeonggi-do,Korea,18448"}]},{"given":"Minjung","family":"Park","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Foundry Division,Hwaseong-si,Gyeonggi-do,Korea,18448"}]},{"given":"Seiseung","family":"Yoon","sequence":"additional","affiliation":[{"name":"Samsung Electronics,Foundry Division,Hwaseong-si,Gyeonggi-do,Korea,18448"}]}],"member":"263","reference":[{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/DAC18072.2020.9218532"},{"key":"ref7","doi-asserted-by":"crossref","first-page":"97800p","DOI":"10.1117\/12.2222289","article-title":"Standard cell pin access and physical design in advanced lithography","volume":"9780","author":"xu","year":"2016","journal-title":"Optical Microlithography XXI"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/SOCC.2017.8226007"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS45731.2020.9180592"},{"key":"ref3","first-page":"94221q","article-title":"Overlay and edge placement control strategies for the 7nm node using EUV and ArF lithography","volume":"9422","author":"mulkens","year":"2015","journal-title":"Extreme Ultraviolet (EUV) Lithography II"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/3061639.3062302"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1145\/3036669.3036679"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1145\/2742060.2742084"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2015.2513670"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1145\/1735023.1735028"}],"event":{"name":"2023 IEEE 36th International System-on-Chip Conference (SOCC)","start":{"date-parts":[[2023,9,5]]},"location":"Santa Clara, CA, USA","end":{"date-parts":[[2023,9,8]]}},"container-title":["2023 IEEE 36th International System-on-Chip Conference (SOCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10256666\/10256705\/10256816.pdf?arnumber=10256816","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,10,9]],"date-time":"2023-10-09T18:13:09Z","timestamp":1696875189000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10256816\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,9,5]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/socc58585.2023.10256816","relation":{},"subject":[],"published":{"date-parts":[[2023,9,5]]}}}