{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,24]],"date-time":"2026-07-24T04:17:47Z","timestamp":1784866667818,"version":"3.55.0"},"reference-count":21,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,9,5]],"date-time":"2023-09-05T00:00:00Z","timestamp":1693872000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,9,5]],"date-time":"2023-09-05T00:00:00Z","timestamp":1693872000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100000001","name":"National Science Foundation","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100000001","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,9,5]]},"DOI":"10.1109\/socc58585.2023.10257022","type":"proceedings-article","created":{"date-parts":[[2023,9,22]],"date-time":"2023-09-22T17:45:42Z","timestamp":1695404742000},"page":"1-6","source":"Crossref","is-referenced-by-count":5,"title":["FDSOI Process Based MIV-transistor Utilization for Standard Cell Designs in Monolithic 3D Integration"],"prefix":"10.1109","author":[{"given":"Madhava Sarma","family":"Vemuri","sequence":"first","affiliation":[{"name":"North Dakota State University,Department of Electrical and Computer Engineering,Fargo,North Dakota,58105"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Umamaheswara","family":"Rao Tida","sequence":"additional","affiliation":[{"name":"North Dakota State University,Department of Electrical and Computer Engineering,Fargo,North Dakota,58105"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/MWSCAS48704.2020.9184698"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2013.2273986"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED57927.2023.10129285"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/SOCC49529.2020.9524756"},{"key":"ref20","article-title":"PrimeSim™ Continuum™ Reference Manual: MOSFET Models","year":"2021","journal-title":"Synopsys"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1145\/2627369.2627642"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2013.6509679"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2017.2768330"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2014.2338862"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2018.2887053"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ESSDERC.2015.7324717"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2015.7223698"},{"key":"ref19","doi-asserted-by":"crossref","DOI":"10.1109\/MWSCAS57524.2023.10405987","article-title":"Efficient and Scalable MIV-transistor with Extended Gate in Monolithic 3D Integration","author":"vemuri","year":"2023","journal-title":"IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS)"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2017.2686426"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2007.891300"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM13553.2020.9372102"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1147\/rd.504.0491"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2019.2919606"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1145\/2637481"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ESSDERC.2016.7599627"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/S3S.2016.7804405"}],"event":{"name":"2023 IEEE 36th International System-on-Chip Conference (SOCC)","location":"Santa Clara, CA, USA","start":{"date-parts":[[2023,9,5]]},"end":{"date-parts":[[2023,9,8]]}},"container-title":["2023 IEEE 36th International System-on-Chip Conference (SOCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10256666\/10256705\/10257022.pdf?arnumber=10257022","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,10,28]],"date-time":"2024-10-28T19:55:23Z","timestamp":1730145323000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10257022\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,9,5]]},"references-count":21,"URL":"https:\/\/doi.org\/10.1109\/socc58585.2023.10257022","relation":{},"subject":[],"published":{"date-parts":[[2023,9,5]]}}}