{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,18]],"date-time":"2025-11-18T06:20:06Z","timestamp":1763446806429,"version":"3.45.0"},"reference-count":22,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,9,29]],"date-time":"2025-09-29T00:00:00Z","timestamp":1759104000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,9,29]],"date-time":"2025-09-29T00:00:00Z","timestamp":1759104000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100002858","name":"China Postdoctoral Science Foundation","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100002858","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,9,29]]},"DOI":"10.1109\/socc66126.2025.11235312","type":"proceedings-article","created":{"date-parts":[[2025,11,17]],"date-time":"2025-11-17T18:39:03Z","timestamp":1763404743000},"page":"1-6","source":"Crossref","is-referenced-by-count":0,"title":["OPAMP-Free Ferroelectric Capacitive Computing-in-Memory Accelerator for Energy-Efficient Binary Neural Networks"],"prefix":"10.1109","author":[{"given":"Jingyun","family":"Gu","sequence":"first","affiliation":[{"name":"The Hong Kong University of Science and Technology (Guangzhou),Guangzhou,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Can","family":"Liu","sequence":"additional","affiliation":[{"name":"Hangzhou Institute of Technology, Xidian University,Hangzhou,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yuqing","family":"Chen","sequence":"additional","affiliation":[{"name":"Hangzhou Dianzi University,Hangzhou,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhihao","family":"Shen","sequence":"additional","affiliation":[{"name":"Hangzhou Institute of Technology, Xidian University,Hangzhou,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wei","family":"Mao","sequence":"additional","affiliation":[{"name":"Hangzhou Institute of Technology, Xidian University,Hangzhou,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Genquan","family":"Han","sequence":"additional","affiliation":[{"name":"Hangzhou Institute of Technology, Xidian University,Hangzhou,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Lei","family":"He","sequence":"additional","affiliation":[{"name":"Eastern Institute of Technology,Ningbo,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jiang","family":"Xu","sequence":"additional","affiliation":[{"name":"The Hong Kong University of Science and Technology (Guangzhou),Guangzhou,China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2020.2976475"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/APCCAS55924.2022.10090308"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1145\/3386263.3407582"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JETCAS.2022.3212314"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2020.2971642"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/MED.2023.3293060"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1007\/s11432-025-4432-x"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM19574.2021.9720508"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/LSSC.2024.3361011"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1007\/s11432-024-4421-0"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/VLSITechnologyandCir46769.2022.9830291"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/FPT.2016.7929192"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2023.3241163"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ICSICT.2018.8565811"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ETS54262.2022.9810414"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/VLSI-SoC62099.2024.10767789"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/MSSC.2016.2546199"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2021.3108148"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/VLSITechnologyandCir46769.2022.9830291"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.23919\/ICS.2025.3571019"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2024.3486322"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2023.3330080"}],"event":{"name":"2025 IEEE 38th International System-on-Chip Conference (SOCC)","start":{"date-parts":[[2025,9,29]]},"location":"Dubai, United Arab Emirates","end":{"date-parts":[[2025,10,1]]}},"container-title":["2025 IEEE 38th International System-on-Chip Conference (SOCC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11235309\/11235311\/11235312.pdf?arnumber=11235312","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,11,18]],"date-time":"2025-11-18T06:15:19Z","timestamp":1763446519000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11235312\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,9,29]]},"references-count":22,"URL":"https:\/\/doi.org\/10.1109\/socc66126.2025.11235312","relation":{},"subject":[],"published":{"date-parts":[[2025,9,29]]}}}