{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,24]],"date-time":"2026-02-24T08:55:31Z","timestamp":1771923331241,"version":"3.50.1"},"reference-count":36,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,9,28]],"date-time":"2025-09-28T00:00:00Z","timestamp":1759017600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,9,28]],"date-time":"2025-09-28T00:00:00Z","timestamp":1759017600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,9,28]]},"DOI":"10.1109\/soli66289.2025.11396321","type":"proceedings-article","created":{"date-parts":[[2026,2,23]],"date-time":"2026-02-23T20:46:45Z","timestamp":1771879605000},"page":"63-68","source":"Crossref","is-referenced-by-count":0,"title":["Vision-Language RAG for Post-AOI PCB Inspection"],"prefix":"10.1109","author":[{"given":"Min Sik","family":"Byun","sequence":"first","affiliation":[{"name":"Singapore Institute of Technology,Infocomm Technology,Singapore"}]},{"given":"Malcolm","family":"Yoke Hean Low","sequence":"additional","affiliation":[{"name":"Singapore Institute of Technology,Infocomm Technology,Singapore"}]},{"given":"David Weidong","family":"Lin","sequence":"additional","affiliation":[{"name":"Singapore Institute of Technology,Singapore"}]},{"given":"Ching","family":"Chung Hong","sequence":"additional","affiliation":[{"name":"Operation Venture Corporation Limited,Singapore"}]},{"given":"Yoke Chuan","family":"Tan","sequence":"additional","affiliation":[{"name":"Operation Venture Corporation Limited,Singapore"}]},{"given":"Desmond","family":"Pang Ngin Ong","sequence":"additional","affiliation":[{"name":"Operation Venture Corporation Limited,Singapore"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/28.753638"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.3390\/app9183750"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/cscwd49262.2021.9437846"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.25103\/jestr.171.19"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/cisp.2011.6100553"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1007\/s10845-016-1270-6"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/dese58274.2023.10099694"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1038\/s41598-022-16302-3"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1007\/978-981-99-3608-3_25"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1007\/s44163-023-00081-5"},{"key":"ref11","article-title":"Inspection and testing methods for PCBs: An overview","volume":"401","author":"Houdek","year":"2016","journal-title":"Caltronics Design & Assembly, White Paper"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmsy.2023.08.019"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1016\/j.micpro.2020.103807"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/isesd.2016.7886753"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/icsp.2018.8652335"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1049\/joe.2018.8270"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/tsm.2019.2911062"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/icus.2017.8278352"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/tcpmt.2018.2873744"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/tim.2022.3201945"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.3934\/mbe.2021223"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/icmcce51767.2020.00287"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1016\/j.eswa.2021.115673"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-031-08545-1_40"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.28991\/hij-2022-03-01-01"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/access.2020.3029127"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.21303\/2461-4262.2022.002127"},{"key":"ref28","article-title":"Automated visual inspection system for enhanced PCB manufacturing quality","author":"Chikwarti","year":"2024","journal-title":"ResearchGate Preprint"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/access.2023.3339561"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1016\/j.autcon.2024.105594"},{"key":"ref31","doi-asserted-by":"crossref","DOI":"10.1145\/3676536.3676750","article-title":"FabGPT: An efficient large multimodal model for complex wafer defect knowledge queries","author":"Jiang","year":"2024"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1021\/acs.jcim.1c00567"},{"key":"ref33","article-title":"GPT-4o mini: advancing cost-efficient intelligence","volume-title":"OpenAI","year":"2024"},{"key":"ref34","first-page":"8748","article-title":"Learning transferable visual models from natural language supervision","volume-title":"Proc. 38th Int. Conf. Mach. Learn. (ICML)","volume":"139","author":"Radford"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1145\/3448016.3457550"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/access.2024.3430329"}],"event":{"name":"2025 IEEE International Conference on Service Operations and Logistics, and Informatics (SOLI)","location":"Singapore","start":{"date-parts":[[2025,9,28]]},"end":{"date-parts":[[2025,9,30]]}},"container-title":["2025 IEEE International Conference on Service Operations and Logistics, and Informatics (SOLI)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11396074\/11396101\/11396321.pdf?arnumber=11396321","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,2,24]],"date-time":"2026-02-24T07:51:18Z","timestamp":1771919478000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11396321\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,9,28]]},"references-count":36,"URL":"https:\/\/doi.org\/10.1109\/soli66289.2025.11396321","relation":{},"subject":[],"published":{"date-parts":[[2025,9,28]]}}}