{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,23]],"date-time":"2026-01-23T11:05:44Z","timestamp":1769166344323,"version":"3.49.0"},"reference-count":34,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2024,8,1]],"date-time":"2024-08-01T00:00:00Z","timestamp":1722470400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,8,1]],"date-time":"2024-08-01T00:00:00Z","timestamp":1722470400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,8,1]],"date-time":"2024-08-01T00:00:00Z","timestamp":1722470400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62274052"],"award-info":[{"award-number":["62274052"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62374049"],"award-info":[{"award-number":["62374049"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62027815"],"award-info":[{"award-number":["62027815"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Key Research and Development Projects in Anhui Province","award":["202304a05020003"],"award-info":[{"award-number":["202304a05020003"]}]},{"name":"University Synergy Innovation Program of Anhui Province","award":["GXXT-2023-011"],"award-info":[{"award-number":["GXXT-2023-011"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Aerosp. Electron. Syst."],"published-print":{"date-parts":[[2024,8]]},"DOI":"10.1109\/taes.2024.3379962","type":"journal-article","created":{"date-parts":[[2024,3,21]],"date-time":"2024-03-21T18:54:55Z","timestamp":1711047295000},"page":"4590-4600","source":"Crossref","is-referenced-by-count":6,"title":["NEST: A Quadruple-Node Upset Recovery Latch Design and Algorithm-Based Recovery Optimization"],"prefix":"10.1109","volume":"60","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-8695-4478","authenticated-orcid":false,"given":"Zhengfeng","family":"Huang","sequence":"first","affiliation":[{"name":"School of Microelectronics, HeFei University of Technology, Hefei, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0004-0910-3361","authenticated-orcid":false,"given":"Liting","family":"Sun","sequence":"additional","affiliation":[{"name":"School of Microelectronics, HeFei University of Technology, Hefei, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0009-4204-6473","authenticated-orcid":false,"given":"Xu","family":"Wang","sequence":"additional","affiliation":[{"name":"School of Microelectronics, HeFei University of Technology, Hefei, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0307-7236","authenticated-orcid":false,"given":"Huaguo","family":"Liang","sequence":"additional","affiliation":[{"name":"School of Microelectronics, HeFei University of Technology, Hefei, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2621-0933","authenticated-orcid":false,"given":"Yingchun","family":"Lu","sequence":"additional","affiliation":[{"name":"School of Microelectronics, HeFei University of Technology, Hefei, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0024-987X","authenticated-orcid":false,"given":"Aibin","family":"Yan","sequence":"additional","affiliation":[{"name":"School of Microelectronics, HeFei University of Technology, Hefei, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0000-8368-2876","authenticated-orcid":false,"given":"Jun","family":"Pan","sequence":"additional","affiliation":[{"name":"School of Microelectronics, HeFei University of Technology, Hefei, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8305-604X","authenticated-orcid":false,"given":"Xiaoqing","family":"Wen","sequence":"additional","affiliation":[{"name":"Graduate School of Computer Science and Systems Engineering, Kyushu Institute of Technology, Fukuoka, Japan"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/T-ED.1979.19370"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2002.805402"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2013.2255624"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2016.2634626"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2013.2260357"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/EDSSC.2017.8126562"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2011.5784522"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TETC.2020.3025584"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/16.701475"},{"key":"ref10","first-page":"241","article-title":"Chapter 7 Robustness","volume-title":"CMOS VLSI Design: A Circuits and Systems Perspective","author":"Weste","year":"2010"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/23.556880"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1049\/iet-cdt.2008.0099"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2022.3213212"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TAES.2022.3219372"},{"issue":"9","key":"ref15","first-page":"2508","article-title":"A low-cost triple-node-upset-resilient latch design","volume":"43","author":"Huang","year":"2020","journal-title":"J. Electron. Inf. Technol."},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.3390\/electronics10202457"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/VTS.2017.7928930"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TETC.2017.2776285"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2011.2177135"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/MSE.2007.44"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1515\/9781400882618-003"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TR.1964.5214855"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1016\/j.mejo.2021.105243"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2010.5488680"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2001.979501"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2010.24"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2015.2509983"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1007\/s10836-015-5551-3"},{"key":"ref29","first-page":"237","article-title":"Chapter 7 sequential logic circuit design","volume-title":"Digital Integrated Circuits: A Design Perspective","author":"Rabaey","year":"2003"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2006.886223"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/RADECS.2016.8093097"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2020.2973676"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2022.3204827"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/TAES.2022.3216795"}],"container-title":["IEEE Transactions on Aerospace and Electronic Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7\/10631738\/10477594.pdf?arnumber=10477594","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,8,10]],"date-time":"2024-08-10T05:12:57Z","timestamp":1723266777000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10477594\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,8]]},"references-count":34,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/taes.2024.3379962","relation":{},"ISSN":["0018-9251","1557-9603","2371-9877"],"issn-type":[{"value":"0018-9251","type":"print"},{"value":"1557-9603","type":"electronic"},{"value":"2371-9877","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,8]]}}}