{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,8]],"date-time":"2026-04-08T21:02:35Z","timestamp":1775682155412,"version":"3.50.1"},"reference-count":37,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2026,1,1]],"date-time":"2026-01-01T00:00:00Z","timestamp":1767225600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2026,1,1]],"date-time":"2026-01-01T00:00:00Z","timestamp":1767225600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,1,1]],"date-time":"2026-01-01T00:00:00Z","timestamp":1767225600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100003995","name":"Natural Science Foundation of Anhui Province","doi-asserted-by":"publisher","award":["2408085MF168"],"award-info":[{"award-number":["2408085MF168"]}],"id":[{"id":"10.13039\/501100003995","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Anhui Province New Era Education Quality","award":["20231hpysfjd007"],"award-info":[{"award-number":["20231hpysfjd007"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Aerosp. Electron. Syst."],"published-print":{"date-parts":[[2026]]},"DOI":"10.1109\/taes.2026.3660817","type":"journal-article","created":{"date-parts":[[2026,2,9]],"date-time":"2026-02-09T21:10:03Z","timestamp":1770671403000},"page":"5974-5985","source":"Crossref","is-referenced-by-count":0,"title":["Low-Delay, High-Robustness DNU Self-Healing Latch Based on the C-Element Feedback Loop"],"prefix":"10.1109","volume":"62","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-9596-8142","authenticated-orcid":false,"given":"Na","family":"Bai","sequence":"first","affiliation":[{"name":"School of Integrated Circuits, Anhui University, Hefei, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0000-0878-2295","authenticated-orcid":false,"given":"Pengfei","family":"Xu","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Anhui University, Hefei, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0861-1802","authenticated-orcid":false,"given":"Yaohua","family":"Xu","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Anhui University, Hefei, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8305-604X","authenticated-orcid":false,"given":"Xiaoqing","family":"Wen","sequence":"additional","affiliation":[{"name":"School of Computer Science and Systems Engineering, Kyushu Institute of Technology, Fukuoka, Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/tc.2015.2509983"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/icee.2018.8472552"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/dft52944.2021.9568359"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/icee50131.2020.9260685"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2013.02.012"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2021.114110"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/tvlsi.2016.2645282"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/csicc49403.2020.9050077"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1166\/jno.2018.2365"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2022.114881"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/tcsi.2020.3018328"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/tetc.2023.3317070"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/tns.2023.3257744"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/tcad.2024.3426271"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1049\/iet-cdt.2008.0099"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2016.06.004"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/tcsii.2018.2849028"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/tcsi.2020.2973676"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/dft.2018.8602841"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/tvlsi.2021.3110135"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/tdmr.2019.2945917"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/access.2022.3233812"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/compeng60905.2024.10741502"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/tcsii.2023.3324006"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1145\/3526241.3530321"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/access.2021.3104335"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/taes.2025.3546581"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/tcsi.2024.3382988"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/taes.2024.3525448"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/itc-asia62534.2024.10661360"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/cads.2012.6316420"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/tvlsi.2004.824302"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/itc50671.2022.00020"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/taes.2019.2925448"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/tcsi.2011.2177135"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1080\/00223131.2013.821959"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/23.903813"}],"container-title":["IEEE Transactions on Aerospace and Electronic Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/7\/11316225\/11386998.pdf?arnumber=11386998","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,4,8]],"date-time":"2026-04-08T20:08:12Z","timestamp":1775678892000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11386998\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026]]},"references-count":37,"URL":"https:\/\/doi.org\/10.1109\/taes.2026.3660817","relation":{},"ISSN":["0018-9251","1557-9603","2371-9877"],"issn-type":[{"value":"0018-9251","type":"print"},{"value":"1557-9603","type":"electronic"},{"value":"2371-9877","type":"electronic"}],"subject":[],"published":{"date-parts":[[2026]]}}}