{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,20]],"date-time":"2026-01-20T04:09:29Z","timestamp":1768882169306,"version":"3.49.0"},"reference-count":21,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"2","license":[{"start":{"date-parts":[[2016,4,1]],"date-time":"2016-04-01T00:00:00Z","timestamp":1459468800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Automat. Sci. Eng."],"published-print":{"date-parts":[[2016,4]]},"DOI":"10.1109\/tase.2015.2403836","type":"journal-article","created":{"date-parts":[[2015,3,11]],"date-time":"2015-03-11T18:57:53Z","timestamp":1426100273000},"page":"757-771","source":"Crossref","is-referenced-by-count":15,"title":["Stereo Vision Based Automated Solder Ball Height and Substrate Coplanarity Inspection"],"prefix":"10.1109","volume":"13","author":[{"given":"Jinjin","family":"Li","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Bonnie L.","family":"Bennett","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Lina J.","family":"Karam","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jeff S.","family":"Pettinato","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1007\/s00138-012-0432-6"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1023\/A:1014573219977"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ICPR.2006.1033"},{"key":"ref13","first-page":"1","article-title":"A region based stereo matching algorithm using cooperative optimization","author":"wang","year":"2008","journal-title":"Proc IEEE Conf Comput Vision Pattern Recognit (CVPR)"},{"key":"ref14","author":"hartley","year":"2002","journal-title":"Multiple View Geometry in Computer Vision"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ICCV.1999.791289"},{"key":"ref16","year":"2013","journal-title":"Camera calibration toolbox for MATLAB website"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1504\/IJMIC.2011.037835"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2010.2043097"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1023\/B:VISI.0000029664.99615.94"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1088\/0957-0233\/11\/3\/320"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2002.808010"},{"key":"ref6","first-page":"607004","article-title":"Height inspection of wafer bumps without explicit 3D reconstruction","volume":"6070","author":"dong","year":"2006","journal-title":"Proc SPIE Int Soc Opt Eng"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1117\/1.1906003"},{"key":"ref8","year":"1996","journal-title":"Method of inspecting an array of solder ball connections of an integrated circuit module"},{"key":"ref7","year":"2010","journal-title":"Method and apparatus for 3-dimensional vision and inspection of ball and like protrusions of electronic components"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/6104.778175"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/95.623031"},{"key":"ref9","year":"2009","journal-title":"The inspection system"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-540-39903-2_89"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1007\/BF02163027"}],"container-title":["IEEE Transactions on Automation Science and Engineering"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8856\/7447676\/7058457.pdf?arnumber=7058457","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,10,11]],"date-time":"2021-10-11T02:34:22Z","timestamp":1633919662000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7058457\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,4]]},"references-count":21,"journal-issue":{"issue":"2"},"URL":"https:\/\/doi.org\/10.1109\/tase.2015.2403836","relation":{},"ISSN":["1545-5955","1558-3783"],"issn-type":[{"value":"1545-5955","type":"print"},{"value":"1558-3783","type":"electronic"}],"subject":[],"published":{"date-parts":[[2016,4]]}}}