{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,27]],"date-time":"2026-05-27T10:52:07Z","timestamp":1779879127123,"version":"3.53.1"},"reference-count":29,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2018,10,1]],"date-time":"2018-10-01T00:00:00Z","timestamp":1538352000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"funder":[{"DOI":"10.13039\/501100001588","name":"Enterprise Ireland","doi-asserted-by":"publisher","award":["CC\/2010\/1001"],"award-info":[{"award-number":["CC\/2010\/1001"]}],"id":[{"id":"10.13039\/501100001588","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Automat. Sci. Eng."],"published-print":{"date-parts":[[2018,10]]},"DOI":"10.1109\/tase.2017.2786213","type":"journal-article","created":{"date-parts":[[2018,1,22]],"date-time":"2018-01-22T22:31:20Z","timestamp":1516660280000},"page":"1692-1703","source":"Crossref","is-referenced-by-count":13,"title":["A Methodology for Efficient Dynamic Spatial Sampling and Reconstruction of Wafer Profiles"],"prefix":"10.1109","volume":"15","author":[{"given":"Sean","family":"McLoone","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Adrian","family":"Johnston","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Gian Antonio","family":"Susto","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref10","article-title":"Mutually-exclusive-and-collectively-exhaustive feature selection scheme","author":"lee","year":"2017","journal-title":"Appl Soft Comput J"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1038\/nnano.2016.8"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.2307\/1268522"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2010.2098416"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1080\/01621459.1984.10478083"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ASMC.2012.6212875"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TPAMI.2017.2648792"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ASMC.2009.5155966"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2009.2039250"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1029\/GL014i002p00139"},{"key":"ref28","article-title":"Statistical methods for enhanced metrology in semiconductor\/photovoltaic manufacturing","author":"zeng","year":"2012"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2011.2169405"},{"key":"ref27","first-page":"93","article-title":"Integration of scheduling and advanced process control in semiconductor manufacturing: Review and outlook","author":"yugma","year":"2014","journal-title":"Proc IEEE Int Conf Autom Sci Eng (CASE)"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1364\/AO.45.000432"},{"key":"ref6","first-page":"1157","article-title":"An introduction to variable and feature selection","volume":"3","author":"guyon","year":"2003","journal-title":"J Mach Learn Res"},{"key":"ref29","first-page":"1","article-title":"Monitoring wafers’ geometric quality using an additive Gaussian process model","volume":"47","author":"zhang","year":"2016","journal-title":"IIE Trans"},{"key":"ref5","author":"draper","year":"1966","journal-title":"Applied regression analysis"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1002\/0470013192.bsa501"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1080\/0740817X.2011.557030"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1016\/j.csda.2012.08.007"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2014.2360214"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2010.2041775"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1080\/01621459.1993.10476299"},{"key":"ref22","first-page":"658","article-title":"Least angle regression for semiconductor manufacturing modeling","author":"susto","year":"2012","journal-title":"Proc IEEE Int Conf Control Appl (CCA)"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2013.2283147"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1016\/j.cor.2014.05.008"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1002\/asmb.1948"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2010.2089451"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2011.2159139"}],"container-title":["IEEE Transactions on Automation Science and Engineering"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8856\/8481716\/08265176.pdf?arnumber=8265176","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,26]],"date-time":"2022-01-26T08:28:21Z","timestamp":1643185701000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8265176\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,10]]},"references-count":29,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/tase.2017.2786213","relation":{},"ISSN":["1545-5955","1558-3783"],"issn-type":[{"value":"1545-5955","type":"print"},{"value":"1558-3783","type":"electronic"}],"subject":[],"published":{"date-parts":[[2018,10]]}}}