{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,6]],"date-time":"2026-03-06T04:27:46Z","timestamp":1772771266742,"version":"3.50.1"},"reference-count":43,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"am","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100000001","name":"Intel","doi-asserted-by":"publisher","award":["579395195"],"award-info":[{"award-number":["579395195"]}],"id":[{"id":"10.13039\/100000001","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100000001","name":"National Science Foundation","doi-asserted-by":"publisher","award":["CMMI-1922739"],"award-info":[{"award-number":["CMMI-1922739"]}],"id":[{"id":"10.13039\/100000001","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Automat. Sci. Eng."],"published-print":{"date-parts":[[2025]]},"DOI":"10.1109\/tase.2024.3357610","type":"journal-article","created":{"date-parts":[[2024,1,31]],"date-time":"2024-01-31T13:42:15Z","timestamp":1706708535000},"page":"18076-18087","source":"Crossref","is-referenced-by-count":7,"title":["Fast Schedule Recovery Method for Semiconductor Packaging Lines With Machine Failures and Constrained Time Windows"],"prefix":"10.1109","volume":"22","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-8204-8758","authenticated-orcid":false,"given":"Feifan","family":"Wang","sequence":"first","affiliation":[{"name":"School of Computing and Augmented Intelligence, Arizona State University, Tempe, AZ, USA"}]},{"ORCID":"https:\/\/orcid.org\/0009-0007-9319-9977","authenticated-orcid":false,"given":"Yutong","family":"Su","sequence":"additional","affiliation":[{"name":"School of Computing and Augmented Intelligence, Arizona State University, Tempe, AZ, USA"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3452-0795","authenticated-orcid":false,"given":"Feng","family":"Ju","sequence":"additional","affiliation":[{"name":"School of Computing and Augmented Intelligence, Arizona State University, Tempe, AZ, USA"}]},{"ORCID":"https:\/\/orcid.org\/0009-0003-3253-0233","authenticated-orcid":false,"given":"Balakrishnan","family":"Ananthanarayanan","sequence":"additional","affiliation":[{"name":"Intel Technology India Private Ltd., Bengaluru, Karnataka, India"}]},{"given":"Husam","family":"Dauod","sequence":"additional","affiliation":[{"name":"Intel Corporation, Chandler, AZ, USA"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-1180-2717","authenticated-orcid":false,"given":"Nital S.","family":"Patel","sequence":"additional","affiliation":[{"name":"Intel Corporation, Chandler, AZ, USA"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1080\/00207543.2019.1683252"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2012.2221087"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1201\/b11260"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/j.ifacol.2017.08.2349"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/COASE.2018.8560389"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2014.2319302"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1016\/j.simpat.2014.10.008"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2018.2847689"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1016\/j.ejor.2003.08.027"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1115\/1.4035598"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1287\/opre.2015.1372"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1016\/j.ejor.2017.02.029"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.3182\/20140824-6-ZA-1003.00525"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2016.2604371"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2020.2973432"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1016\/j.cie.2018.02.026"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1080\/24725854.2018.1562283"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2019.2920874"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TSMC.2017.2782009"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1016\/j.cherd.2016.10.035"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1007\/s00170-005-0237-0"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-642-33515-0_22"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1080\/002075497195074"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1081\/00207540310001614132"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2019.2956762"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1080\/00207543.2013.847982"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TEM.2017.2769059"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmsy.2018.01.001"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1016\/j.ifacol.2015.06.326"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/TAC.2016.2572119"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/LRA.2016.2581300"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1080\/24725854.2020.1803513"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1080\/24725854.2018.1511937"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/CASE49997.2022.9926676"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2014.2375880"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/TASE.2016.2642997"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/WSC.2012.6465235"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1016\/j.cor.2018.06.009"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.1996.534560"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1115\/1.2912181"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2003.07.004"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1002\/(SICI)1099-1425(200001\/02)3:1<3::AID-JOS32>3.0.CO;2-Y"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.3390\/su10114123"}],"container-title":["IEEE Transactions on Automation Science and Engineering"],"original-title":[],"link":[{"URL":"https:\/\/ieeexplore.ieee.org\/ielam\/8856\/10839176\/10418183-aam.pdf","content-type":"application\/pdf","content-version":"am","intended-application":"syndication"},{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8856\/10839176\/10418183.pdf?arnumber=10418183","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,7,16]],"date-time":"2025-07-16T06:13:05Z","timestamp":1752646385000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10418183\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025]]},"references-count":43,"URL":"https:\/\/doi.org\/10.1109\/tase.2024.3357610","relation":{},"ISSN":["1545-5955","1558-3783"],"issn-type":[{"value":"1545-5955","type":"print"},{"value":"1558-3783","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025]]}}}