{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,1]],"date-time":"2026-05-01T16:22:38Z","timestamp":1777652558407,"version":"3.51.4"},"reference-count":27,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"2","license":[{"start":{"date-parts":[[2025,4,1]],"date-time":"2025-04-01T00:00:00Z","timestamp":1743465600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,4,1]],"date-time":"2025-04-01T00:00:00Z","timestamp":1743465600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,4,1]],"date-time":"2025-04-01T00:00:00Z","timestamp":1743465600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100014188","name":"Institute of Information and Communications Technology Planning and Evaluation","doi-asserted-by":"publisher","award":["2022-0-00020"],"award-info":[{"award-number":["2022-0-00020"]}],"id":[{"id":"10.13039\/501100014188","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100017634","name":"LG Electronics","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100017634","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Biomed. Circuits Syst."],"published-print":{"date-parts":[[2025,4]]},"DOI":"10.1109\/tbcas.2025.3526813","type":"journal-article","created":{"date-parts":[[2025,1,8]],"date-time":"2025-01-08T20:13:01Z","timestamp":1736367181000},"page":"291-299","source":"Crossref","is-referenced-by-count":5,"title":["A Time-Domain Multi-Channel Resistive-Sensor Interface IC With High Energy Efficiency and Wide Input Range"],"prefix":"10.1109","volume":"19","author":[{"ORCID":"https:\/\/orcid.org\/0009-0001-7081-3707","authenticated-orcid":false,"given":"Sunglim","family":"Han","sequence":"first","affiliation":[{"name":"School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0002-2506-5524","authenticated-orcid":false,"given":"Hoyong","family":"Seong","sequence":"additional","affiliation":[{"name":"School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-1540-5102","authenticated-orcid":false,"given":"Sein","family":"Oh","sequence":"additional","affiliation":[{"name":"School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0009-9545-4905","authenticated-orcid":false,"given":"Jimin","family":"Koo","sequence":"additional","affiliation":[{"name":"School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1445-3804","authenticated-orcid":false,"given":"Hanbit","family":"Jin","sequence":"additional","affiliation":[{"name":"Electronics and Telecommunications Research Institute (ETRI), Daejeon, South Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3442-7948","authenticated-orcid":false,"given":"Hye Jin","family":"Kim","sequence":"additional","affiliation":[{"name":"Electronics and Telecommunications Research Institute (ETRI), Daejeon, South Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3589-086X","authenticated-orcid":false,"given":"Sohmyung","family":"Ha","sequence":"additional","affiliation":[{"name":"Division of Engineering, New York University Abu Dhabi, Abu Dhabi, United Arab Emirates"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4580-2771","authenticated-orcid":false,"given":"Minkyu","family":"Je","sequence":"additional","affiliation":[{"name":"School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ICRA.2015.7139889"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1126\/scirobotics.abc8801"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1186\/s40557-014-0022-3"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/s0140-6736(05)71086-2"},{"issue":"9778","key":"ref5","doi-asserted-by":"crossref","first-page":"1693","DOI":"10.1016\/S0140-6736(11)60325-5","article-title":"Stroke rehabilitation","volume":"377","author":"Langhorne","year":"2011","journal-title":"Lancet"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1038\/s41551-021-00767-0"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1038\/s41528-022-00233-0"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1039\/C8TC02946F"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1021\/acsami.9b07465"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-021-00585-x"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1039\/D1MH00538C"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ESSCIRC.2019.8902918"},{"key":"ref13","first-page":"186","article-title":"A wheatstone bridge temperature sensor with a resolution FoM of 20fJ.K${}^{2}$","volume-title":"Proc. IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers","author":"Pan","year":"2019"},{"issue":"3","key":"ref14","doi-asserted-by":"crossref","first-page":"1171","DOI":"10.1109\/TCSI.2021.3134010","article-title":"A 46-nF\/10-M$\\Omega$ range 114-aF\/0.37-$\\Omega$ resolution parasitic-and temperature-insensitive reconfigurable RC-to-digital converter in 0.18-$\\mu$m CMOS","volume":"69","author":"George","year":"2022","journal-title":"IEEE Trans. Circuits Syst. I, Reg. Papers"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/vlsic.2015.7231311"},{"key":"ref16","first-page":"328","article-title":"A 2.5 nJ duty-cycled bridge-to-digital converter integrated in a 13 mm${}^{3}$ pressure-sensing system","volume-title":"Proc. IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers","author":"Oh","year":"2018"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2022.3187828"},{"issue":"3","key":"ref18","doi-asserted-by":"crossref","first-page":"856","DOI":"10.1109\/JSSC.2018.2885556","article-title":"An energy-efficient 3.7-nV\/$Hz$ bridge readout IC with a stable bridge offset compensation scheme","volume":"54","author":"Jiang","year":"2018","journal-title":"IEEE J. Solid-State Circuits"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3030995"},{"key":"ref20","first-page":"1","article-title":"A 72-channel resistive-and-capacitive sensor interface achieving 0.74 $\\mu$W\/channel and 0.038 mm${}^{2}$\/channel by noise-orthogonalizing and pad-sharing techniques","volume-title":"Proc. IEEE Custom Integr. Circuits Conf. (CICC)","author":"Feng","year":"2023"},{"key":"ref21","first-page":"1","article-title":"A 20 $\\mu$W, 0.05 mm${}^{2}$ duty-cycled resistor and frequency-locked-loop-based wheatstone bridge interface for low resistance sensing systems","volume-title":"Proc. IEEE Custom Integr. Circuits Conf. (CICC)","author":"Kim","year":"2021"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2023.3286796"},{"key":"ref23","first-page":"1","article-title":"A 118.6 fJ\/conversion-step two-step time-domain RC-to-digital converter with 33 nF\/10 M$\\Omega$ range and 53 aF${}_{rms}$ resolution","volume-title":"Proc. IEEE Asian Solid-State Circuits Conf. (A-SSCC)","author":"Seong","year":"2022"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS58744.2024.10558586"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.2987681"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2010.5537663"},{"issue":"1","key":"ref27","doi-asserted-by":"crossref","first-page":"82","DOI":"10.1038\/s41528-022-00216-1","article-title":"Highly pixelated, untethered tactile interfaces for an ultra-flexible on-skin telehaptic system","volume":"6","author":"Jin","year":"2022","journal-title":"NPJ Flex. Electron."}],"container-title":["IEEE Transactions on Biomedical Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/4156126\/10947481\/10834531.pdf?arnumber=10834531","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,4,4]],"date-time":"2025-04-04T19:53:11Z","timestamp":1743796391000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10834531\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,4]]},"references-count":27,"journal-issue":{"issue":"2"},"URL":"https:\/\/doi.org\/10.1109\/tbcas.2025.3526813","relation":{},"ISSN":["1932-4545","1940-9990"],"issn-type":[{"value":"1932-4545","type":"print"},{"value":"1940-9990","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,4]]}}}