{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,19]],"date-time":"2025-12-19T07:33:26Z","timestamp":1766129606635,"version":"3.48.0"},"reference-count":50,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"6","license":[{"start":{"date-parts":[[2025,12,1]],"date-time":"2025-12-01T00:00:00Z","timestamp":1764547200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,12,1]],"date-time":"2025-12-01T00:00:00Z","timestamp":1764547200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,12,1]],"date-time":"2025-12-01T00:00:00Z","timestamp":1764547200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62350710216"],"award-info":[{"award-number":["62350710216"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62434006"],"award-info":[{"award-number":["62434006"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"National Key Research and Development Program of China","award":["2022YFB4400800"],"award-info":[{"award-number":["2022YFB4400800"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Biomed. Circuits Syst."],"published-print":{"date-parts":[[2025,12]]},"DOI":"10.1109\/tbcas.2025.3567524","type":"journal-article","created":{"date-parts":[[2025,5,6]],"date-time":"2025-05-06T13:03:12Z","timestamp":1746536592000},"page":"1160-1174","source":"Crossref","is-referenced-by-count":0,"title":["Artifact-Tolerant Electrophysiological Sensor Interface With 3.6V\/1.8V DM\/CM Input Range and 52.3mV\n                    <sub>pp<\/sub>\n                    \/${\\mu}$s Recovery Using Asynchronous Signal Folding"],"prefix":"10.1109","volume":"19","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-2662-7066","authenticated-orcid":false,"given":"Qiao","family":"Cai","sequence":"first","affiliation":[{"name":"Department of Micro\/Nano Electronics and MoE Key Lab of Artificial Intelligence, Shanghai Jiao Tong University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5869-1631","authenticated-orcid":false,"given":"Xinzi","family":"Xu","sequence":"additional","affiliation":[{"name":"Department of Micro\/Nano Electronics and MoE Key Lab of Artificial Intelligence, Shanghai Jiao Tong University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0307-609X","authenticated-orcid":false,"given":"Yanxing","family":"Suo","sequence":"additional","affiliation":[{"name":"Department of Micro\/Nano Electronics and MoE Key Lab of Artificial Intelligence, Shanghai Jiao Tong University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0006-8380-3416","authenticated-orcid":false,"given":"Guanghua","family":"Qian","sequence":"additional","affiliation":[{"name":"Department of Micro\/Nano Electronics and MoE Key Lab of Artificial Intelligence, Shanghai Jiao Tong University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6322-8614","authenticated-orcid":false,"given":"Yongfu","family":"Li","sequence":"additional","affiliation":[{"name":"Department of Micro\/Nano Electronics and MoE Key Lab of Artificial Intelligence, Shanghai Jiao Tong University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0235-1475","authenticated-orcid":false,"given":"Guoxing","family":"Wang","sequence":"additional","affiliation":[{"name":"Department of Micro\/Nano Electronics and MoE Key Lab of Artificial Intelligence, Shanghai Jiao Tong University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5289-5219","authenticated-orcid":false,"given":"Yong","family":"Lian","sequence":"additional","affiliation":[{"name":"Department of Micro\/Nano Electronics and MoE Key Lab of Artificial Intelligence, Shanghai Jiao Tong University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2236-6092","authenticated-orcid":false,"given":"Yang","family":"Zhao","sequence":"additional","affiliation":[{"name":"Department of Micro\/Nano Electronics and MoE Key Lab of Artificial Intelligence, Shanghai Jiao Tong University, Shanghai, China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2023.3344889"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2021.3112756"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2023.3321295"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1007\/s11432-024-4196-0"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2019.2954479"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2021.3091198"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.2991526"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3056040"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.2018.8502286"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/a-sscc53895.2021.9634824"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2022.3223988"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/tbcas.2024.3495652"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2018.8310269"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2021.3108725"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/tbcas.2025.3533612"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2018.8310388"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/cicc53496.2022.9772782"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2022.3225559"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2017.7870454"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2016.7417924"},{"issue":"10","key":"ref21","first-page":"1385","article-title":"A 2.3-\u00b5W ECG-on-chip for wearable sensors","volume":"65","author":"Deepu","year":"2018","journal-title":"IEEE Trans. Circuits Syst. II, Exp. Briefs"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2009.2014707"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.2008.4585959"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2019.2963174"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2024.3352414"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2022.3177241"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2023.3298662"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2021.3062632"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.23919\/vlsitechnologyandcir57934.2023.10185276"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/vlsitechnologyandcir46783.2024.10631447"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/CICC60959.2024.10529096"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2024.3514745"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC49661.2025.10904745"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2024.3525071"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2024.3374891"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/cicc60959.2024.10529074"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2018.8310316"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2008.2011581"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2019.2957030"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2013.2288680"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731712"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2013.2254484"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2018.2841037"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2018.2854862"},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.1109\/4.340424"},{"key":"ref46","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3090100"},{"key":"ref47","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2019.2924416"},{"key":"ref48","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2013.2253217"},{"key":"ref49","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3074636"},{"key":"ref50","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2018.2859837"}],"container-title":["IEEE Transactions on Biomedical Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/4156126\/11297896\/10988742.pdf?arnumber=10988742","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,12,19]],"date-time":"2025-12-19T07:28:30Z","timestamp":1766129310000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10988742\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,12]]},"references-count":50,"journal-issue":{"issue":"6"},"URL":"https:\/\/doi.org\/10.1109\/tbcas.2025.3567524","relation":{},"ISSN":["1932-4545","1940-9990"],"issn-type":[{"type":"print","value":"1932-4545"},{"type":"electronic","value":"1940-9990"}],"subject":[],"published":{"date-parts":[[2025,12]]}}}