{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,11]],"date-time":"2026-07-11T17:22:10Z","timestamp":1783790530464,"version":"3.55.0"},"reference-count":58,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"11","license":[{"start":{"date-parts":[[2019,11,1]],"date-time":"2019-11-01T00:00:00Z","timestamp":1572566400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,11,1]],"date-time":"2019-11-01T00:00:00Z","timestamp":1572566400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,11,1]],"date-time":"2019-11-01T00:00:00Z","timestamp":1572566400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"Humboldt Research Fellowship"},{"DOI":"10.13039\/501100001659","name":"German Research Foundation","doi-asserted-by":"crossref","id":[{"id":"10.13039\/501100001659","id-type":"DOI","asserted-by":"crossref"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput."],"published-print":{"date-parts":[[2019,11,1]]},"DOI":"10.1109\/tc.2019.2916869","type":"journal-article","created":{"date-parts":[[2019,5,14]],"date-time":"2019-05-14T19:57:31Z","timestamp":1557863851000},"page":"1647-1662","source":"Crossref","is-referenced-by-count":27,"title":["On the Efficiency of Voltage Overscaling under Temperature and Aging Effects"],"prefix":"10.1109","volume":"68","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-5649-3102","authenticated-orcid":false,"given":"Hussam","family":"Amrouch","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9832-9397","authenticated-orcid":false,"given":"Seyed Borna","family":"Ehsani","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6748-2054","authenticated-orcid":false,"given":"Andreas","family":"Gerstlauer","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jorg","family":"Henkel","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1145\/2155620.2155622"},{"key":"ref38","article-title":"45 nm open cell library","year":"0"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1145\/1669112.1669169"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1145\/1289816.1289873"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2009.4796528"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1145\/2187671.2187675"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/SMACD.2018.8434855"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2009.5280814"},{"key":"ref35","first-page":"1","article-title":"Aging-aware adaptive voltage scaling in 22 nm high-K\/metal-gate tri-gate CMOS","author":"cho","year":"2015","journal-title":"Proc IEEE Custom Integr Circuits Conf"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2011.2168433"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/MICRO.2008.4771785"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2012.6164957"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/MICRO.2007.11"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.23919\/DATE.2017.7926978"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4614-0748-5_2"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1145\/1165573.1165599"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/JETCAS.2018.2856838"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2013.2243658"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1145\/3061639.3062331"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA.2009.4798242"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1145\/1146909.1147172"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/ICCD.2018.00039"},{"key":"ref50","doi-asserted-by":"publisher","DOI":"10.1109\/40.16792"},{"key":"ref51","doi-asserted-by":"crossref","first-page":"1382","DOI":"10.1109\/TC.2009.56","article-title":"Reliability-aware energy management for periodic real-time tasks","volume":"58","author":"zhu","year":"2009","journal-title":"IEEE Trans Comput"},{"key":"ref58","first-page":"6a","article-title":"Predictive TCAD for NBTI stress-recovery in various device architectures and channel materials","author":"subrat","year":"2017","journal-title":"Proc IEEE Int Rel Physics Symp"},{"key":"ref57","doi-asserted-by":"publisher","DOI":"10.1109\/TIP.2005.860338"},{"key":"ref56","year":"0"},{"key":"ref55","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2018.2882229"},{"key":"ref54","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2006.876103"},{"key":"ref53","doi-asserted-by":"publisher","DOI":"10.1109\/IISWC.2009.5306797"},{"key":"ref52","doi-asserted-by":"publisher","DOI":"10.1109\/ISPASS.2009.4919648"},{"key":"ref10","first-page":"11","article-title":"Self-heating on bulk finfet from 14 nm down to 7 nm node","author":"jang","year":"2015","journal-title":"Proc IEEE Int Electron Devices Meeting"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2014.7001394"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1109\/4.753685"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2009.5090694"},{"key":"ref13","first-page":"1","article-title":"Controlled timing-error acceptance for low energy IDCT design","author":"he","year":"2011","journal-title":"Proc Design Automation Test in Eur"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1145\/1594233.1594282"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/SIPS.2009.5336238"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2010.5419690"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2009.2016665"},{"key":"ref18","doi-asserted-by":"crossref","first-page":"813","DOI":"10.1109\/92.974895","article-title":"Soft digital signal processing","volume":"9","author":"hedge","year":"2001","journal-title":"IEEE Trans VLSI Syst"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2006.874359"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/MDAT.2015.2501310"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2017.2780083"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2004.85"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1145\/2897937.2898082"},{"key":"ref8","author":"hu","year":"2010","journal-title":"Modern Semiconductor Devices for Integrated Circuits"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ETS.2013.6569370"},{"key":"ref49","author":"kopetz","year":"2011","journal-title":"Real-Time Systems Design Principles for Distributed Embedded Applications"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2017.2717790"},{"key":"ref46","article-title":"NVIDIA's next generation cuda compute architecture: Kepler gk110","author":"nvidia","year":"2012","journal-title":"Whitepaper"},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.1145\/2508148.2485964"},{"key":"ref48","doi-asserted-by":"publisher","DOI":"10.1109\/ICPADS.1998.741030"},{"key":"ref47","doi-asserted-by":"publisher","DOI":"10.1145\/1080695.1070013"},{"key":"ref42","article-title":"Synopsys EDA Tools Flow","year":"0"},{"key":"ref41","article-title":"Predictive Technology Model","year":"0"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2016.2523439"},{"key":"ref43","article-title":"Degradation-Aware Cell Libraries","year":"0"}],"container-title":["IEEE Transactions on Computers"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/12\/8862968\/08713926.pdf?arnumber=8713926","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,13]],"date-time":"2022-07-13T21:07:16Z","timestamp":1657746436000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8713926\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,11,1]]},"references-count":58,"journal-issue":{"issue":"11"},"URL":"https:\/\/doi.org\/10.1109\/tc.2019.2916869","relation":{},"ISSN":["0018-9340","1557-9956","2326-3814"],"issn-type":[{"value":"0018-9340","type":"print"},{"value":"1557-9956","type":"electronic"},{"value":"2326-3814","type":"electronic"}],"subject":[],"published":{"date-parts":[[2019,11,1]]}}}