{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,3]],"date-time":"2026-07-03T01:04:35Z","timestamp":1783040675885,"version":"3.54.6"},"reference-count":43,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2022,4,1]],"date-time":"2022-04-01T00:00:00Z","timestamp":1648771200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2022,4,1]],"date-time":"2022-04-01T00:00:00Z","timestamp":1648771200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,4,1]],"date-time":"2022-04-01T00:00:00Z","timestamp":1648771200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput."],"published-print":{"date-parts":[[2022,4,1]]},"DOI":"10.1109\/tc.2021.3065454","type":"journal-article","created":{"date-parts":[[2021,3,11]],"date-time":"2021-03-11T21:08:03Z","timestamp":1615496883000},"page":"906-918","source":"Crossref","is-referenced-by-count":9,"title":["Impact of NCFET Technology on Eliminating the Cooling Cost and Boosting the Efficiency of Google TPU"],"prefix":"10.1109","volume":"71","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-1044-7231","authenticated-orcid":false,"given":"Sami","family":"Salamin","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8110-7122","authenticated-orcid":false,"given":"Georgios","family":"Zervakis","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0148-0523","authenticated-orcid":false,"given":"Florian","family":"Klemme","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hammam","family":"Kattan","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3356-8917","authenticated-orcid":false,"given":"Yogesh","family":"Chauhan","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9602-2922","authenticated-orcid":false,"given":"Jorg","family":"Henkel","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5649-3102","authenticated-orcid":false,"given":"Hussam","family":"Amrouch","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","article-title":"PULPino Processor Platform,","year":"2017"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1145\/2980024.2872414"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/STHERM.2010.5444290"},{"key":"ref4","volume-title":"The Datacenter as a Computer: Designing Warehouse-Scale Machines","author":"Barroso","year":"2018"},{"key":"ref5","article-title":"Google brings liquid cooling to data centers to cool latest AI chips,","year":"2018"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4419-5768-9"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2017.2661700"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.3390\/mi9060287"},{"key":"ref9","article-title":"Giant data centres use billions of litres of water to cool down computers,","year":"2020"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1038\/ncomms10302"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1038\/nnano.2008.417"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2014.01.074"},{"key":"ref13","article-title":"Highly reliable thermoelectric coolingapparatus and method,","year":"1999"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2017.8268393"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1021\/n1071804g"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2020.3013567"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2020.3012753"},{"key":"ref18","first-page":"1","article-title":"Performance, power and cooling trade-offs with NCFET-based many-cores,","author":"Rapp","year":"2019","journal-title":"Des. Autom. Conf."},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/ISLPED.2017.8009170"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ISLPED.2019.8824802"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.23919\/DATE48585.2020.9116301"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2020.2981395"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-030-52017-5"},{"key":"ref24","article-title":"BSIM-CMG Technical Manual,","year":"2018"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2014.7046976"},{"key":"ref26","first-page":"1","article-title":"Demonstration of high-speed hysteresis-free negative capacitance in ferroelectric Hf0.5Zr0.5O2,","volume-title":"Proc. IEEE Int. Electron Devices Meeting","author":"Hoffmann"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2016.90"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2020.2990672"},{"issue":"309","key":"ref29","doi-asserted-by":"crossref","first-page":"1040","DOI":"10.1080\/14786444908561372","article-title":"XCVI. Theory of barium titanate: Part I,","volume":"40","author":"Frederick","year":"1949","journal-title":"London Edinburgh Dublin Philos. Mag. J. Sci."},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2016.2614432"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2016.2614436"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1038\/s41586-018-0854-z"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1002\/adfm.201103119"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2018.2870519"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2019.2892186"},{"key":"ref36","article-title":"Synopsys EDA tool flows,","year":"2018"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2017.2731343"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2018.8510626"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/ESSCIRC.2016.7598240"},{"key":"ref40","article-title":"Bfloat16: The secret to high performance on cloud tpus,","year":"2019"},{"key":"ref41","article-title":"Hotchips 2019 tutorial,","year":"2019"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2018.2870916"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2013.2273873"}],"container-title":["IEEE Transactions on Computers"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/12\/9732510\/09376251.pdf?arnumber=9376251","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,10]],"date-time":"2024-01-10T00:20:44Z","timestamp":1704846044000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9376251\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,4,1]]},"references-count":43,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/tc.2021.3065454","relation":{},"ISSN":["0018-9340","1557-9956","2326-3814"],"issn-type":[{"value":"0018-9340","type":"print"},{"value":"1557-9956","type":"electronic"},{"value":"2326-3814","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022,4,1]]}}}