{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,5]],"date-time":"2026-06-05T15:57:35Z","timestamp":1780675055446,"version":"3.54.1"},"reference-count":39,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"7","license":[{"start":{"date-parts":[[2025,7,1]],"date-time":"2025-07-01T00:00:00Z","timestamp":1751328000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,7,1]],"date-time":"2025-07-01T00:00:00Z","timestamp":1751328000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,7,1]],"date-time":"2025-07-01T00:00:00Z","timestamp":1751328000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"National Key Research Plan of China","award":["2023YFB4402400"],"award-info":[{"award-number":["2023YFB4402400"]}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62474005"],"award-info":[{"award-number":["62474005"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62034006"],"award-info":[{"award-number":["62034006"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["U20A20204"],"award-info":[{"award-number":["U20A20204"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"STIC","award":["QYJS-2022-1501-B"],"award-info":[{"award-number":["QYJS-2022-1501-B"]}]},{"name":"111 Project Program","award":["B18001"],"award-info":[{"award-number":["B18001"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput."],"published-print":{"date-parts":[[2025,7]]},"DOI":"10.1109\/tc.2025.3558068","type":"journal-article","created":{"date-parts":[[2025,4,8]],"date-time":"2025-04-08T17:25:31Z","timestamp":1744133131000},"page":"2321-2333","source":"Crossref","is-referenced-by-count":5,"title":["CIMUS: 3D-Stacked Computing-in-Memory Under Image Sensor Architecture for Efficient Machine Vision"],"prefix":"10.1109","volume":"74","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-4721-1564","authenticated-orcid":false,"given":"Lixia","family":"Han","sequence":"first","affiliation":[{"name":"School of Integrated Circuits, Peking University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0004-7931-0999","authenticated-orcid":false,"given":"Yiyang","family":"Chen","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Peking University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0003-5431-9228","authenticated-orcid":false,"given":"Siyuan","family":"Chen","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Peking University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7224-474X","authenticated-orcid":false,"given":"Haozhang","family":"Yang","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Peking University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0001-8200-5360","authenticated-orcid":false,"given":"Ao","family":"Shi","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Peking University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5504-134X","authenticated-orcid":false,"given":"Guihai","family":"Yu","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Peking University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4154-5608","authenticated-orcid":false,"given":"Jiaqi","family":"Li","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Peking University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0008-3957-3144","authenticated-orcid":false,"given":"Zheng","family":"Zhou","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Peking University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0159-2231","authenticated-orcid":false,"given":"Yijiao","family":"Wang","sequence":"additional","affiliation":[{"name":"School of Integrated Circuit Science and Engineering, Beihang University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3024-7990","authenticated-orcid":false,"given":"Yanzhi","family":"Wang","sequence":"additional","affiliation":[{"name":"Northeastern University, Boston, MA, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0007-8018-651X","authenticated-orcid":false,"given":"Xiaoyan","family":"Liu","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Peking University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6286-0423","authenticated-orcid":false,"given":"Jinfeng","family":"Kang","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Peking University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3280-0099","authenticated-orcid":false,"given":"Peng","family":"Huang","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Peking University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1038\/s41586-024-07409-w"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR52729.2023.02106"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2021.3065104"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1038\/s41598-020-62935-7"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731584"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1007\/s11831-022-09831-7"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM19573.2019.8993452"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD57390.2023.10323842"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3034192"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2023.3285734"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1145\/3579371.3589089"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42613.2021.9365965"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2021.3075219"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.23919\/VLSITechnologyandCir57934.2023.10185308"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2023.3285896"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2018.2877890"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3142436"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.3390\/s20113101"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.23919\/vlsicircuits52068.2021.9492432"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1145\/3007787.3001164"},{"key":"ref21","first-page":"214","article-title":"Heterogenous integration using chiplets and advanced packaging","volume-title":"Proc. IEDM Short Course","author":"Swaminathan","year":"2021"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1145\/3007787.3001139"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731775"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3031290"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365932"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/isscc49657.2024.10454468"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2018.2882194"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/DAC18074.2021.9586271"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/ICIP.2019.8803607"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR42600.2020.00277"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/DAC.2018.8465832"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1145\/3579371.3589064"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2016.7418107"},{"key":"ref34","article-title":"CACTI 6.0: A tool to model large caches","volume":"27","author":"Muralimanohar","year":"2009","journal-title":"HP Lab."},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2020.3043731"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1145\/2749469.2750389"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/iedm.2017.8268419"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2023.3337061"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2024.3358220"}],"container-title":["IEEE Transactions on Computers"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/12\/11030070\/10949700.pdf?arnumber=10949700","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,12]],"date-time":"2025-06-12T19:24:46Z","timestamp":1749756286000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10949700\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,7]]},"references-count":39,"journal-issue":{"issue":"7"},"URL":"https:\/\/doi.org\/10.1109\/tc.2025.3558068","relation":{},"ISSN":["0018-9340","1557-9956","2326-3814"],"issn-type":[{"value":"0018-9340","type":"print"},{"value":"1557-9956","type":"electronic"},{"value":"2326-3814","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,7]]}}}