{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,18]],"date-time":"2026-03-18T06:07:44Z","timestamp":1773814064020,"version":"3.50.1"},"reference-count":45,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2026,4,1]],"date-time":"2026-04-01T00:00:00Z","timestamp":1775001600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2026,4,1]],"date-time":"2026-04-01T00:00:00Z","timestamp":1775001600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,4,1]],"date-time":"2026-04-01T00:00:00Z","timestamp":1775001600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput."],"published-print":{"date-parts":[[2026,4]]},"DOI":"10.1109\/tc.2026.3654341","type":"journal-article","created":{"date-parts":[[2026,1,14]],"date-time":"2026-01-14T20:39:56Z","timestamp":1768423196000},"page":"1518-1532","source":"Crossref","is-referenced-by-count":0,"title":["Cooling as You Wish: Component-Level Cooling for Heterogeneous Edge Datacenters"],"prefix":"10.1109","volume":"75","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-8570-1345","authenticated-orcid":false,"given":"Fangming","family":"Liu","sequence":"first","affiliation":[{"name":"Peng Cheng Laboratory, Shenzhen, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8870-4309","authenticated-orcid":false,"given":"Qiangyu","family":"Pei","sequence":"additional","affiliation":[{"name":"National Engineering Research Center for Big Data Technology and System, the Services Computing Technology and System Lab, Huazhong University of Science and Technology, Wuhan, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5869-3899","authenticated-orcid":false,"given":"Shutong","family":"Chen","sequence":"additional","affiliation":[{"name":"School of Computer, Electronics and Information, Guangxi University, Nanning, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0001-1960-5662","authenticated-orcid":false,"given":"Yongjie","family":"Yuan","sequence":"additional","affiliation":[{"name":"National Engineering Research Center for Big Data Technology and System, the Services Computing Technology and System Lab, Huazhong University of Science and Technology, Wuhan, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2507-4773","authenticated-orcid":false,"given":"Qixia","family":"Zhang","sequence":"additional","affiliation":[{"name":"National Engineering Research Center for Big Data Technology and System, the Services Computing Technology and System Lab, Huazhong University of Science and Technology, Wuhan, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0003-3521-7226","authenticated-orcid":false,"given":"Xinhui","family":"Zhu","sequence":"additional","affiliation":[{"name":"National Engineering Research Center for Big Data Technology and System, the Services Computing Technology and System Lab, Huazhong University of Science and Technology, Wuhan, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0008-1022-862X","authenticated-orcid":false,"given":"Ziyang","family":"Jia","sequence":"additional","affiliation":[{"name":"School of Computer Science and Technology, Huazhong University of Science and Technology, Wuhan, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1590-5323","authenticated-orcid":false,"given":"Fei","family":"Xu","sequence":"additional","affiliation":[{"name":"School of Computer Science and Technology, East China Normal University, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0008-6574-6395","authenticated-orcid":false,"given":"Dong","family":"Zhang","sequence":"additional","affiliation":[{"name":"Jinan Inspur Data Company Ltd., Jinan, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0009-6255-1055","authenticated-orcid":false,"given":"Bingheng","family":"Yan","sequence":"additional","affiliation":[{"name":"Jinan Inspur Data Company Ltd., Jinan, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","article-title":"Edge computing market size, share & industry analysis","year":"2025"},{"key":"ref2","article-title":"State of the edge 2020","year":"2020"},{"key":"ref3","article-title":"State of the edge 2021","year":"2021"},{"key":"ref4","article-title":"Electricity 2024, analysis and forecast to 2026","author":"\u00c7am","year":"2024"},{"key":"ref5","article-title":"Introducing the Microsoft Azure Modular Datacenter","author":"Karagounis","year":"2020"},{"key":"ref6","article-title":"Tencent Cloud opens 5G edge computing center","author":"Yu","year":"2020"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1145\/3487552.3487815"},{"key":"ref8","article-title":"Intelligent data centers built for automation and performance at the edge","author":"Vapor","year":"2025"},{"key":"ref9","article-title":"Open Rack\/SpecsAndDesigns","year":"2021"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1145\/2806777.2806938"},{"key":"ref11","article-title":"Liquid cooling technologies for data centers and edge applications","year":"2019"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA51647.2021.00078"},{"key":"ref13","first-page":"474","article-title":"Fine-grained warm water cooling for improving datacenter economy","volume-title":"Proc. 46th Annu. Int. Symp. Comput. Archit.","author":"Jiang","year":"2019"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2016.7517635"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1145\/2670979.2670996"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA.2011.5749756"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1145\/3676641.3716025"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1145\/3698038.3698556"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2006.876103"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA.2008.4658632"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2017.2768417"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA.2012.6169035"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1145\/2694344.2694378"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/ICDCS.2019.00069"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1145\/3503222.3507713"},{"key":"ref26","article-title":"Price of the proportional solenoid valve","year":"2021"},{"key":"ref27","article-title":"Price of the 2-way solenoid valve","year":"2023"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/ISCA45697.2020.00042"},{"key":"ref29","first-page":"945","article-title":"MLaaS in the wild: Workload analysis and scheduling in large-scale heterogeneous GPU clusters","volume-title":"Proc. 19th USENIX Symp. Networked Syst. Des. Implementation","author":"Weng","year":"2022"},{"key":"ref30","article-title":"Air-cooled chillers","year":"2025"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1145\/3603746"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/ICDCS.2019.00070"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/TPDS.2013.208"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2022.3158476"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2012.143"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1145\/3617232.3624853"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1145\/3620666.3651329"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1145\/2254756.2254778"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/STHERM.2012.6188853"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1109\/TSUSC.2025.3542563"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1145\/2487166.2487183"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1109\/TSUSC.2022.3210564"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1145\/2499368.2451123"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1145\/3698038.3698544"},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.1145\/3575693.3575709"}],"container-title":["IEEE Transactions on Computers"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/12\/11435995\/11353441.pdf?arnumber=11353441","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,3,18]],"date-time":"2026-03-18T05:13:13Z","timestamp":1773810793000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11353441\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,4]]},"references-count":45,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/tc.2026.3654341","relation":{},"ISSN":["0018-9340","1557-9956","2326-3814"],"issn-type":[{"value":"0018-9340","type":"print"},{"value":"1557-9956","type":"electronic"},{"value":"2326-3814","type":"electronic"}],"subject":[],"published":{"date-parts":[[2026,4]]}}}