{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,21]],"date-time":"2025-11-21T11:23:46Z","timestamp":1763724226714},"reference-count":23,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"10","license":[{"start":{"date-parts":[[2008,10,1]],"date-time":"2008-10-01T00:00:00Z","timestamp":1222819200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2008,10]]},"DOI":"10.1109\/tcad.2008.2003275","type":"journal-article","created":{"date-parts":[[2008,9,24]],"date-time":"2008-09-24T17:54:34Z","timestamp":1222278874000},"page":"1840-1851","source":"Crossref","is-referenced-by-count":6,"title":["Rapid Detailed Temperature Estimation for Highly Coupled IC Interconnect"],"prefix":"10.1109","volume":"27","author":[{"given":"A.","family":"Labun","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"K.","family":"Jagjitkumar","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","first-page":"155","article-title":"one-dimensional estimation of interconnect temperatures","author":"labun","year":"2002","journal-title":"Proc IEEE Int Integr Reliab Workshop Final Rep"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/SISPAD.2003.1233628"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2005.847944"},{"key":"ref13","first-page":"336","article-title":"modeling and analysis of via hot spots and implications for ulsi interconnect reliability","author":"im","year":"2002","journal-title":"Proc IEEE Int Reliab Phys Symp"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2001.968613"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.2003.1221225"},{"key":"ref16","first-page":"33","author":"press","year":"1986","journal-title":"Numerical Recipes with Source Code CD-ROM 3rd Edition The Art of Scientific Computing"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1145\/321556.321565"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2005.1560164"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/ICSICT.2004.1435061"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/j.mejo.2006.11.017"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/43.759073"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2004.1319245"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2005.858276"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2002.804385"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2005.1560144"},{"key":"ref2","first-page":"24","article-title":"the nvax cpu chip: design challenges, methods, and cad tools","volume":"4","author":"donchin","year":"1992","journal-title":"Digit Tech J"},{"key":"ref1","first-page":"148","article-title":"mass transport of aluminum by momentum exchange with conducting electrons","author":"black","year":"1967","journal-title":"Proc IEEE Int Reliab Phys Symp"},{"key":"ref9","doi-asserted-by":"crossref","first-page":"172","DOI":"10.1109\/RELPHY.1996.492078","article-title":"item: a chip-level electromigration reliability diagnosis tool using electrothermal timing simulation","author":"teng","year":"1996","journal-title":"Proc IEEE Int Reliab Phys Symp"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/IRWS.1998.745358"},{"key":"ref22","first-page":"621","article-title":"stapa finite element simulator for three-dimensional thermal analysis of interconnect structures","author":"sabelka","year":"1997","journal-title":"Proc 9th Simul Ind Eur Simul Symp"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/IRWS.1999.830558"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/43.486272"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/43\/4627531\/04627543.pdf?arnumber=4627543","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,11,29]],"date-time":"2021-11-29T20:40:14Z","timestamp":1638218414000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/4627543\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2008,10]]},"references-count":23,"journal-issue":{"issue":"10"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2008.2003275","relation":{},"ISSN":["0278-0070"],"issn-type":[{"value":"0278-0070","type":"print"}],"subject":[],"published":{"date-parts":[[2008,10]]}}}