{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,29]],"date-time":"2026-03-29T16:31:12Z","timestamp":1774801872729,"version":"3.50.1"},"reference-count":31,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"7","license":[{"start":{"date-parts":[[2009,7,1]],"date-time":"2009-07-01T00:00:00Z","timestamp":1246406400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2009,7]]},"DOI":"10.1109\/tcad.2009.2018876","type":"journal-article","created":{"date-parts":[[2009,6,16]],"date-time":"2009-06-16T19:05:37Z","timestamp":1245179137000},"page":"1006-1016","source":"Crossref","is-referenced-by-count":13,"title":["ELIAD: Efficient Lithography Aware Detailed Routing Algorithm With Compact and Macro Post-OPC Printability Prediction"],"prefix":"10.1109","volume":"28","author":[{"family":"Minsik Cho","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Kun Yuan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Yongchan Ban","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"D.Z.","family":"Pan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/ICCD.1997.628931"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1145\/1146909.1147108"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2005.1466186"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1117\/12.605222"},{"key":"ref12","year":"0"},{"key":"ref13","year":"0"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1145\/1231996.1232004"},{"key":"ref15","first-page":"186","article-title":"optical proximity correction (opc)-friendly maze routing","author":"huang","year":"2004","journal-title":"Proc Des Autom Conf"},{"key":"ref16","first-page":"628104","article-title":"fast dual-graph based hot-spot detection","author":"kahng","year":"2006","journal-title":"Proc BACUS Symp Photomask Technology"},{"key":"ref17","doi-asserted-by":"crossref","first-page":"65210d","DOI":"10.1117\/12.717055","article-title":"model-assisted routing for improved lithography robustness","volume":"6521","author":"kong","year":"2007","journal-title":"Proc SPIE"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/43.240078"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1145\/1118299.1118376"},{"key":"ref28","first-page":"839","article-title":"accurate detection for process-hotspots with vias and incomplete specification","author":"xu","year":"2007","journal-title":"Proc Int Conf Comput Aided Des"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2006.884492"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2005.1466544"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/DAC.2006.229321"},{"key":"ref6","first-page":"55","article-title":"troy: track router with yield-driven wire planning","author":"cho","year":"2007","journal-title":"Proc Des Autom Conf"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2006.320026"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1145\/1233501.1233599"},{"key":"ref8","author":"dong","year":"2007","journal-title":"Neural Network Based Algorithm for Multi-Constrained Shortest Path Problem"},{"key":"ref7","author":"cobb","year":"1998","journal-title":"Fast optical and process proximity correction algorithms for integrated circuit manufacturing"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1017\/CBO9781139644181"},{"key":"ref9","author":"gbondo-tugbawa","year":"2002","journal-title":"Chip-scale modeling of pattern dependencies in copper chemical mechanical polishing process"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2004.1382639"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1145\/640000.640026"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2006.320161"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1145\/1065579.1065678"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1117\/12.608020"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/66.554485"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2005.1466157"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/43.931037"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/43\/5075803\/05075817.pdf?arnumber=5075817","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,10,11]],"date-time":"2021-10-11T00:04:51Z","timestamp":1633910691000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5075817\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,7]]},"references-count":31,"journal-issue":{"issue":"7"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2009.2018876","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"value":"0278-0070","type":"print"},{"value":"1937-4151","type":"electronic"}],"subject":[],"published":{"date-parts":[[2009,7]]}}}