{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,27]],"date-time":"2025-10-27T10:36:42Z","timestamp":1761561402773},"reference-count":13,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"2","license":[{"start":{"date-parts":[[2010,2,1]],"date-time":"2010-02-01T00:00:00Z","timestamp":1264982400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2010,2]]},"DOI":"10.1109\/tcad.2009.2035577","type":"journal-article","created":{"date-parts":[[2010,1,26]],"date-time":"2010-01-26T17:31:25Z","timestamp":1264527085000},"page":"185-196","source":"Crossref","is-referenced-by-count":53,"title":["Double Patterning Layout Decomposition for Simultaneous Conflict and Stitch Minimization"],"prefix":"10.1109","volume":"29","author":[{"given":"Kun","family":"Yuan","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jae-Seok","family":"Yang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"David Z.","family":"Pan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","first-page":"69240o 1","article-title":"post-decomposition assessment of double patterning layout","volume":"6924","author":"rubinstein","year":"2008","journal-title":"Proc Soc Photo-Opt Instrum Eng"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2008.4681616"},{"key":"ref12","year":"0"},{"key":"ref13","year":"0"},{"key":"ref4","first-page":"692409 1","article-title":"split and design guidelines for double patterning","volume":"6924","author":"wiaux","year":"2008","journal-title":"Proc Soc Photo-Opt Instrum Eng"},{"key":"ref3","first-page":"65200h 1","article-title":"issues and challenges of double patterning lithography in dram","volume":"6520","author":"kim","year":"2007","journal-title":"Proc Soc Photo-Opt Instrum Eng"},{"key":"ref6","first-page":"69244e 1","article-title":"22 nm half-pitch patterning by cvd spacer self alignment double patterning (sadp)","volume":"6924","author":"bencher","year":"2008","journal-title":"Proc Soc Photo-Opt Instrum Eng"},{"key":"ref5","article-title":"lithography 2009 overview of opportunities","author":"borodovsky","year":"0","journal-title":"Semicon West"},{"key":"ref8","first-page":"69243m 1","article-title":"development of layout split algorithms and printability evaluation for double patterning technology","volume":"6924","author":"chiou","year":"2008","journal-title":"Proc Soc Photo-Opt Instrum Eng"},{"key":"ref7","first-page":"652109 1","article-title":"double patterning design split implementation and validation for the 32 nm node","volume":"6521","author":"drapeau","year":"2007","journal-title":"Proc Soc Photo-Opt Instrum Eng"},{"key":"ref2","first-page":"65200g 1","article-title":"pitch doubling through dual-patterning lithography challenges in integration and litho budgets","volume":"6520","author":"dusa","year":"2007","journal-title":"Proc Soc Photo-Opt Instrum Eng"},{"key":"ref1","article-title":"double patterning lithography: the bridge between low k1 arf and euv","author":"dusa","year":"2008","journal-title":"Microlithography World"},{"key":"ref9","first-page":"692404 1","article-title":"toward 3 nm overlay and critical dimension uniformity: an integrated error budget for double patterning lithography","volume":"6924","author":"arnold","year":"2008","journal-title":"Proc Soc Photo-Opt Instrum Eng"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/43\/5395722\/05395742.pdf?arnumber=5395742","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,10,11]],"date-time":"2021-10-11T01:00:41Z","timestamp":1633914041000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5395742\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2010,2]]},"references-count":13,"journal-issue":{"issue":"2"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2009.2035577","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"value":"0278-0070","type":"print"},{"value":"1937-4151","type":"electronic"}],"subject":[],"published":{"date-parts":[[2010,2]]}}}