{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,29]],"date-time":"2026-03-29T16:29:17Z","timestamp":1774801757106,"version":"3.50.1"},"reference-count":38,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"9","license":[{"start":{"date-parts":[[2011,9,1]],"date-time":"2011-09-01T00:00:00Z","timestamp":1314835200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2011,9]]},"DOI":"10.1109\/tcad.2011.2144596","type":"journal-article","created":{"date-parts":[[2011,8,25]],"date-time":"2011-08-25T15:52:11Z","timestamp":1314287531000},"page":"1293-1306","source":"Crossref","is-referenced-by-count":49,"title":["Thermal Modeling and Analysis for 3-D ICs With Integrated Microchannel Cooling"],"prefix":"10.1109","volume":"30","author":[{"given":"H.","family":"Mizunuma","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Yi-Chang Lu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Chia-Lin Yang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2007.364540"},{"key":"ref33","first-page":"98","article-title":"An 80-tile 1.28TFLOPS network-on-chip in 65 nm CMOS","author":"vangal","year":"2007","journal-title":"Proc IEEE Int Solid-State Circuits Conf"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijheatmasstransfer.2004.11.019"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2005.136"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2002.996687"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2006.1696060"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2006.136"},{"key":"ref35","first-page":"8","article-title":"A case for thermal-aware floorplanning at the microarchitectural level","volume":"8","author":"sankaranarayanan","year":"2005","journal-title":"J Instruction-Level Parallelism"},{"key":"ref34","year":"0","journal-title":"12 Volt DC Pumps Datasheet"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2008.4546911"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2008.4544386"},{"key":"ref12","doi-asserted-by":"crossref","first-page":"2","DOI":"10.1145\/871656.859620","article-title":"Temperature-aware microarchitecture","author":"skadron","year":"2003","journal-title":"Proc Int Symp Comput Architect"},{"key":"ref13","first-page":"878","article-title":"Compact thermal modeling for temperature-aware design","author":"wei huang","year":"2004","journal-title":"Proceedings 41st Design Automation Conference 2004 DAC"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2006.882589"},{"key":"ref15","first-page":"727","article-title":"Full chip thermal analysis of planer (2-D) and vertically integrated (3-D) high performance ICs","author":"im","year":"2000","journal-title":"Proc Electron Devices Meet IEDM Tech Dig Int"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/STHERM.1993.225330"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1115\/1.2792068"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1115\/1.2905703"},{"key":"ref19","year":"0","journal-title":"Fluid Flow Simulation Software"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2010.5653749"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/EDL.1981.25367"},{"key":"ref27","first-page":"111","article-title":"Energy-efficient variable-flow liquid cooling in 3-D stacked architecture","author":"coskun","year":"2010","journal-title":"Proc Des Automat Test Eur"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1145\/1146909.1147160"},{"key":"ref6","doi-asserted-by":"crossref","first-page":"598","DOI":"10.1109\/TCAPT.2003.817652","article-title":"Thermal design methodology for high-heat-flux single-phase and two-phase micro-channel heat sinks","volume":"26","author":"qu","year":"2003","journal-title":"IEEE Trans Compon Packag Technol"},{"key":"ref29","author":"shah","year":"1978","journal-title":"Laminar Flow Forced Convection in Ducts"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1115\/IPACK2007-33329"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1080\/10655130214159"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2003.811473"},{"key":"ref2","doi-asserted-by":"crossref","first-page":"130","DOI":"10.1145\/1150019.1136497","article-title":"Design and management of 3-D chip multiprocessors using network-in-memory","author":"li","year":"2006","journal-title":"Proc Int Symp Comput Architect"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1115\/1.1839582"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1145\/1148015.1148016"},{"key":"ref20","year":"0","journal-title":"Mechanical Analysis FloTHERM"},{"key":"ref22","first-page":"610","article-title":"Co-design of signal, power, and thermal distribution networks for 3-D ICs","author":"lee","year":"2009","journal-title":"Proc Design Automation Test Eur Conf Exhibit"},{"key":"ref21","year":"0","journal-title":"ANSYS FLUENT Software"},{"key":"ref24","first-page":"472","article-title":"The impact of liquid cooling on 3-D multi-core processors","author":"jang","year":"2009","journal-title":"Proc Int Conf Comput Des"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1115\/1.4000885"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1145\/1391469.1391660"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1145\/1168857.1168873"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/43\/5989977\/05989994.pdf?arnumber=5989994","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T16:53:47Z","timestamp":1642006427000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5989994\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2011,9]]},"references-count":38,"journal-issue":{"issue":"9"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2011.2144596","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"value":"0278-0070","type":"print"},{"value":"1937-4151","type":"electronic"}],"subject":[],"published":{"date-parts":[[2011,9]]}}}