{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,7,6]],"date-time":"2024-07-06T04:45:46Z","timestamp":1720241146753},"reference-count":31,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"5","license":[{"start":{"date-parts":[[2012,5,1]],"date-time":"2012-05-01T00:00:00Z","timestamp":1335830400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2012,5]]},"DOI":"10.1109\/tcad.2011.2180384","type":"journal-article","created":{"date-parts":[[2012,4,20]],"date-time":"2012-04-20T15:54:54Z","timestamp":1334937294000},"page":"676-689","source":"Crossref","is-referenced-by-count":20,"title":["Junction-Level Thermal Analysis of 3-D Integrated Circuits Using High Definition Power Blurring"],"prefix":"10.1109","volume":"31","author":[{"given":"Samson","family":"Melamed","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Thorlindur","family":"Thorolfsson","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"T. Robert","family":"Harris","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shivam","family":"Priyadarshi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Paul","family":"Franzon","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Michael B.","family":"Steer","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"W. Rhett","family":"Davis","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2008.4672172"},{"key":"ref30","author":"melamed","year":"2011","journal-title":"Junction-level thermal analysis of three dimensional integrated circuits"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2007.895754"},{"key":"ref11","doi-asserted-by":"crossref","first-page":"1763","DOI":"10.1109\/TCAD.2005.858276","article-title":"IC thermal simulation and modeling via efficient multigrid-based approaches","volume":"25","author":"li","year":"2006","journal-title":"IEEE Trans Comput -Aided Des Integr Circuits Syst"},{"key":"ref12","article-title":"Ultrafast temperature profile calculation in IC chips","author":"kemper","year":"2006","journal-title":"Proc 12th Int Workshop Thermal Investigations ICs"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijheatmasstransfer.2004.12.032"},{"key":"ref14","author":"eckert","year":"1986","journal-title":"Analysis of Heat and Mass Transfer"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.1999.810635"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2005.1466136"},{"key":"ref17","first-page":"409","article-title":"Fast thermal analysis for VLSI circuits via semi-analytical Green's function in multilayer materials","volume":"2","author":"wang","year":"2004","journal-title":"Proc Int Symp Circuits Syst"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2006.883919"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/THERMINIC.2007.4451740"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA.2002.995695"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/43.712099"},{"key":"ref27","year":"2008","journal-title":"MITLL Low-Power FDSOI CMOS Process Design Guide Revision 2008 6 Advanced Silicon Design Group"},{"key":"ref3","doi-asserted-by":"crossref","first-page":"1587","DOI":"10.1109\/PROC.1969.7340","article-title":"electromigration failure modes in aluminum metallization for semiconductor devices","volume":"57","author":"black","year":"1969","journal-title":"Proceedings of the IEEE"},{"key":"ref6","doi-asserted-by":"crossref","first-page":"115","DOI":"10.1109\/SISPAD.2005.201486","article-title":"coupled simulation of device performance and heating of vertically stacked three-dimensional integrated circuits","author":"akturk","year":"2005","journal-title":"2005 International Conference On Simulation of Semiconductor Processes and Devices"},{"key":"ref29","author":"balay","year":"2011","journal-title":"PETSc Web Page"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2006.884860"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1145\/1870109.1870114"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2004.1319245"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/40.782564"},{"key":"ref9","doi-asserted-by":"crossref","first-page":"280","DOI":"10.1016\/S0167-9317(03)00417-9","article-title":"Thermal conductivity of ultra low-k dielectrics","volume":"70","author":"delan","year":"2003","journal-title":"Microelectron Eng"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1147\/rd.462.0235"},{"key":"ref20","article-title":"Ultra fast calculation of temperature profiles of VLSI ICs in thermal packages considering parameter variations","author":"park","year":"2007","journal-title":"Proc IMAPS 40th Int Symp Microelectron"},{"key":"ref22","first-page":"50","article-title":"Fast computation of temperature profiles of VLSI ICs with high spatial resolution","author":"park","year":"2008","journal-title":"Proc 16th Annu IEEE Semiconductor Thermal Measurement Management Symp SEMI-THERM XVI"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2008.4479805"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/STHERM.2010.5444285"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1115\/InterPACK2009-89072"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2009.5306529"},{"key":"ref25","first-page":"1","article-title":"Adaptive power blurring techniques to calculate IC temperature profile under large temperature variations","author":"ziabari","year":"2010","journal-title":"Proc IMAPS ATW Thermal Manage"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/43\/6185728\/06186865.pdf?arnumber=6186865","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,10,10]],"date-time":"2021-10-10T23:51:43Z","timestamp":1633909903000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6186865\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012,5]]},"references-count":31,"journal-issue":{"issue":"5"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2011.2180384","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"value":"0278-0070","type":"print"},{"value":"1937-4151","type":"electronic"}],"subject":[],"published":{"date-parts":[[2012,5]]}}}