{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,15]],"date-time":"2026-04-15T19:12:29Z","timestamp":1776280349838,"version":"3.50.1"},"reference-count":16,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"11","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2012,11]]},"DOI":"10.1109\/tcad.2012.2202395","type":"journal-article","created":{"date-parts":[[2012,10,16]],"date-time":"2012-10-16T18:03:22Z","timestamp":1350410602000},"page":"1711-1722","source":"Crossref","is-referenced-by-count":7,"title":["Pad Assignment for Die-Stacking System-in-Package Design"],"prefix":"10.1109","volume":"31","author":[{"family":"Wai-Kei Mak","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Yu-Chen Lin","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"C.","family":"Chu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Ting-Chi Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","year":"0","journal-title":"Bond Wire Modeling Standard"},{"key":"ref11","author":"ahuja","year":"1993","journal-title":"Network Flows Theory Algorithms and Applications"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1145\/800158.805069"},{"key":"ref13","author":"vanderbei","year":"2007","journal-title":"Linear Programming Foundations and Extensions"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1007\/BF02614365"},{"key":"ref15","year":"0","journal-title":"CPLEX"},{"key":"ref16","year":"0","journal-title":"Leda package"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2000.835095"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2008.4479803"},{"key":"ref6","author":"golick","year":"2004","journal-title":"EE Times"},{"key":"ref5","author":"wilson","year":"2004","journal-title":"EE Times"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2006.79"},{"key":"ref7","author":"flton","year":"2006","journal-title":"EE Times"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/96.659500"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ETS.2007.40"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1145\/1687399.1687445"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/43\/6331635\/06331649.pdf?arnumber=6331649","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,11,14]],"date-time":"2017-11-14T15:14:10Z","timestamp":1510672450000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6331649\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012,11]]},"references-count":16,"journal-issue":{"issue":"11"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2012.2202395","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"value":"0278-0070","type":"print"},{"value":"1937-4151","type":"electronic"}],"subject":[],"published":{"date-parts":[[2012,11]]}}}