{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,10,23]],"date-time":"2026-10-23T11:56:06Z","timestamp":1792756566525,"version":"4.5.0"},"reference-count":27,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"3","license":[{"start":{"date-parts":[[2013,3,1]],"date-time":"2013-03-01T00:00:00Z","timestamp":1362096000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2013,3]]},"DOI":"10.1109\/tcad.2012.2224346","type":"journal-article","created":{"date-parts":[[2013,2,14]],"date-time":"2013-02-14T14:03:37Z","timestamp":1360850617000},"page":"353-366","source":"Crossref","is-referenced-by-count":106,"title":["RWCap: A Floating Random Walk Solver for 3-D Capacitance Extraction of Very-Large-Scale Integration Interconnects"],"prefix":"10.1109","volume":"32","author":[{"given":"Wenjian","family":"Yu","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hao","family":"Zhuang","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Chao","family":"Zhang","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Gang","family":"Hu","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zhi","family":"Liu","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/S0038-1101(97)00283-9"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1016\/S0378-4754(00)00246-9"},{"key":"ref12","author":"kamon","year":"2006","journal-title":"EDA for IC Implementation Circuit Design and Process Technology"},{"key":"ref13","author":"desai","year":"1998","journal-title":"The Capacitance Extraction Tool"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ICVD.2005.169"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/VLSID.2006.25"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2008.4681647"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1145\/1687399.1687539"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/75.862222"},{"key":"ref19","first-page":"896","article-title":"Efficient floating random walk algorithm for interconnect capacitance extraction considering multiple dielectrics","author":"hu","year":"2011","journal-title":"Proc IEEE Int Conf ASIC"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2005.850824"},{"key":"ref27","author":"bansal","year":"1999","journal-title":"Randomized algorithms for capacitance estimation"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2003.821930"},{"key":"ref6","first-page":"752","article-title":"A direct integral-equation solver of linear complexity for large-scale 3-D capacitance and impedance extraction","author":"chai","year":"2009","journal-title":"Proc DAC"},{"key":"ref5","doi-asserted-by":"crossref","first-page":"12","DOI":"10.1109\/TCAD.2005.853690","article-title":"Efficient 3-D extraction of interconnect capacitance considering floating metal-fills with boundary element method","volume":"25","author":"yu","year":"2006","journal-title":"IEEE Trans Comput -Aided Des Integr Circuits Syst"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2011.2176137"},{"key":"ref7","doi-asserted-by":"crossref","first-page":"678","DOI":"10.1145\/74382.74502","article-title":"an efficient finite element method for submicron ic capacitance extraction","author":"van der meijs","year":"1989","journal-title":"26th ACM\/IEEE Design Automation Conference"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/43.986426"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1016\/0038-1101(92)90332-7"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/43.97624"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2012.6164977"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/22.216475"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.1971.1127644"},{"key":"ref24","author":"samet","year":"1990","journal-title":"Applications of Spatial Data Structure"},{"key":"ref23","author":"press","year":"1992","journal-title":"Numerical Recipes in C"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/IEMT.2010.5746734"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1145\/272991.272995"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/43\/6461966\/06461990.pdf?arnumber=6461990","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,11,29]],"date-time":"2021-11-29T15:40:24Z","timestamp":1638200424000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6461990\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,3]]},"references-count":27,"journal-issue":{"issue":"3"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2012.2224346","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"value":"0278-0070","type":"print"},{"value":"1937-4151","type":"electronic"}],"subject":[],"published":{"date-parts":[[2013,3]]}}}