{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,24]],"date-time":"2026-07-24T18:49:04Z","timestamp":1784918944419,"version":"3.55.0"},"reference-count":14,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2013,4,1]],"date-time":"2013-04-01T00:00:00Z","timestamp":1364774400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2013,4]]},"DOI":"10.1109\/tcad.2012.2227257","type":"journal-article","created":{"date-parts":[[2013,3,15]],"date-time":"2013-03-15T18:50:47Z","timestamp":1363373447000},"page":"611-615","source":"Crossref","is-referenced-by-count":59,"title":["A 3-D Split Manufacturing Approach to Trustworthy System Development"],"prefix":"10.1109","volume":"32","author":[{"given":"Jonathan","family":"Valamehr","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Timothy","family":"Sherwood","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ryan","family":"Kastner","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"David","family":"Marangoni-Simonsen","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ted","family":"Huffmire","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Cynthia","family":"Irvine","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Timothy","family":"Levin","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-642-28368-0_24"},{"key":"ref11","first-page":"109","article-title":"Complete information flow tracking from the gates up","author":"tiwari","year":"2006","journal-title":"Proc Int Conf ASPLOS"},{"key":"ref12","first-page":"264","article-title":"Introspective 3-D chips","author":"mysore","year":"2006","journal-title":"Proc 10th Int Conf ASPLOS"},{"key":"ref13","first-page":"45","article-title":"3-D extensions for trustworthy systems","author":"huffmire","year":"2011","journal-title":"Proc Int Conf ERSA"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1145\/1146909.1147160"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2007.59"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2012.6176969"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISCA.2008.15"},{"key":"ref5","first-page":"469","article-title":"Die stacking (3-D) microarchitecture","author":"black","year":"2006","journal-title":"Proc 30th Annu IEEE\/ACM Int Symp Microarchitecture (MICRO 30)"},{"key":"ref8","year":"2011","journal-title":"Trusted Integrated Chips (TIC) Program Broad Agency Announcement 1109"},{"key":"ref7","first-page":"525","article-title":"Implementing caches in a 3-D technology for high performance processors","author":"puttaswamy","year":"2006","journal-title":"Proc IEEE ICCD"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2009.4977515"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1145\/1920261.1920292"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1145\/1873548.1873549"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/43\/6480843\/06480852.pdf?arnumber=6480852","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,11,29]],"date-time":"2021-11-29T20:40:24Z","timestamp":1638218424000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6480852\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,4]]},"references-count":14,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2012.2227257","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"value":"0278-0070","type":"print"},{"value":"1937-4151","type":"electronic"}],"subject":[],"published":{"date-parts":[[2013,4]]}}}