{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,21]],"date-time":"2026-02-21T20:09:23Z","timestamp":1771704563063,"version":"3.50.1"},"reference-count":41,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2013,4,1]],"date-time":"2013-04-01T00:00:00Z","timestamp":1364774400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2013,4]]},"DOI":"10.1109\/tcad.2012.2228739","type":"journal-article","created":{"date-parts":[[2013,3,15]],"date-time":"2013-03-15T18:50:47Z","timestamp":1363373447000},"page":"584-596","source":"Crossref","is-referenced-by-count":93,"title":["3-D Mesh-Based Optical Network-on-Chip for Multiprocessor System-on-Chip"],"prefix":"10.1109","volume":"32","author":[{"given":"Yaoyao","family":"Ye","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jiang","family":"Xu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Baihan","family":"Huang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xiaowen","family":"Wu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wei","family":"Zhang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xuan","family":"Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Mahdi","family":"Nikdast","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhehui","family":"Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Weichen","family":"Liu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhe","family":"Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref39","first-page":"1","article-title":"A 1550 nm, 10 Gbps monolithic optical receiver in 130 nm CMOS with integrated Ge waveguide photodetector","author":"masini","year":"2007","journal-title":"1st Int Conf Group IV Photonics"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2007.908692"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/ISVLSI.2011.49"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1364\/CLEO.2010.CME2"},{"key":"ref31","first-page":"1","article-title":"High-speed 1.1-<formula formulatype=\"inline\"><tex Notation=\"TeX\">$\\mu{\\rm m}$<\/tex><\/formula>-range InGaAs VCSELs","author":"anan","year":"2008","journal-title":"Proc Conf Optical Fiber Commun \/Nat Fiber Opt Eng Conf"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2005.856575"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1145\/966763.966764"},{"key":"ref36","first-page":"1","article-title":"Optical technologies can improve the energy efficiency of networks","author":"bonetto","year":"2009","journal-title":"Proc 35th Eur Conf Opt Commun"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/RTSS.2008.49"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA.2009.4798252"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2008.142"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1109\/PS.2007.4300747"},{"key":"ref11","first-page":"1","article-title":"Design of 3-D optical network on chip","author":"gu","year":"2009","journal-title":"Proc Int Optoelectronics Symp Photonics"},{"key":"ref12","first-page":"1","article-title":"System-level modeling and analysis of thermal effects in optical networks-on-chip","volume":"pp","author":"ye","year":"2012","journal-title":"IEEE Trans Very Large Scale Integr Syst"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2007.364438"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/HOTI.2008.32"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2008.4484059"},{"key":"ref16","first-page":"3","article-title":"A low-power fat tree-based optical network-on-chip for multiprocessor system-on-chip","author":"gu","year":"2009","journal-title":"Proc Design Automation Test Europe Conf Exhibition"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1145\/1555754.1555809"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/NOCS.2009.5071453"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1145\/1629911.1629983"},{"key":"ref28","first-page":"98","author":"padgaonkar","year":"2004","journal-title":"NNIN REU Research Accomplishments"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1145\/1555754.1555808"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/JQE.2004.826421"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2007.18"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/NOCS.2007.35"},{"key":"ref29","first-page":"1","article-title":"10 Gbps VCSELs with high single mode output in 1310 nm and 1550 nm wavelength bands","author":"syrbu","year":"2008","journal-title":"Proc Conf Optical Fiber Commun \/Nat Fiber Opt Eng Conf"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISVLSI.2010.17"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1147\/rd.504.0491"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/HOTI.2008.11"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2002.998307"},{"key":"ref9","first-page":"1","article-title":"3-D optical networks-on-chip (NoC) for multiprocessor systems-on-chip (MPSoC)","author":"ye","year":"2009","journal-title":"Proc IEEE Int Conf 3-D Syst Integr"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1145\/378239.379048"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1364\/OE.15.007489"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/ISVLSI.2009.19"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1117\/12.765090"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2009.2014884"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1364\/IPRSN.2010.IMC5"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1145\/1837274.1837441"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/ICCCAS.2009.5250358"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1364\/OE.19.020258"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/43\/6480843\/06480869.pdf?arnumber=6480869","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,11,29]],"date-time":"2021-11-29T20:40:24Z","timestamp":1638218424000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6480869\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,4]]},"references-count":41,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2012.2228739","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"value":"0278-0070","type":"print"},{"value":"1937-4151","type":"electronic"}],"subject":[],"published":{"date-parts":[[2013,4]]}}}