{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,24]],"date-time":"2026-03-24T15:53:24Z","timestamp":1774367604906,"version":"3.50.1"},"reference-count":33,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"2","license":[{"start":{"date-parts":[[2013,2,1]],"date-time":"2013-02-01T00:00:00Z","timestamp":1359676800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2013,2,1]],"date-time":"2013-02-01T00:00:00Z","timestamp":1359676800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2013,2,1]],"date-time":"2013-02-01T00:00:00Z","timestamp":1359676800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2013,2]]},"DOI":"10.1109\/tcad.2012.2233862","type":"journal-article","created":{"date-parts":[[2013,1,21]],"date-time":"2013-01-21T19:09:44Z","timestamp":1358795384000},"page":"228-241","source":"Crossref","is-referenced-by-count":12,"title":["Structure-Aware Placement Techniques for Designs With Datapaths"],"prefix":"10.1109","volume":"32","author":[{"given":"Samuel I.","family":"Ward","sequence":"first","affiliation":[{"name":"University of Texas, Austin, TX, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Myung-Chul","family":"Kim","sequence":"additional","affiliation":[{"name":"IBM Corporation, Austin, TX, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Natarajan","family":"Viswanathan","sequence":"additional","affiliation":[{"name":"IBM Corporation, Austin, TX, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhuo","family":"Li","sequence":"additional","affiliation":[{"name":"IBM Austin Research Laboratory, Austin, TX, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Charles J.","family":"Alpert","sequence":"additional","affiliation":[{"name":"IBM Austin Research Laboratory, Austin, TX, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Earl E.","family":"Swartzlander","sequence":"additional","affiliation":[{"name":"University of Texas, Austin, TX, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"David Z.","family":"Pan","sequence":"additional","affiliation":[{"name":"University of Texas, Austin, TX, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1145\/1735023.1735035"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1145\/2228360.2228499"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1145\/2228360.2228500"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1145\/1960397.1960429"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCS.1981.1084903"},{"key":"ref11","first-page":"97","article-title":"Standard-cell based data-path placement utilizing regularity","volume":"1","author":"yang","year":"2003","journal-title":"Proc IEEE Int Conf ASIC"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1145\/1055137.1055184"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2011.2170567"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1145\/1123008.1123055"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1145\/1233501.1233538"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2007.357975"},{"key":"ref17","first-page":"260","article-title":"Dragon2000: Standard-cell placement tool for large industry circuits","author":"wang","year":"2000","journal-title":"Proc IEEE\/ACM Int Conf Comput -Aided Des"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2000.896511"},{"key":"ref19","author":"ward","year":"2011","journal-title":"ISPD Datapath Benchmark Suite"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2005.1560188"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1145\/988952.988981"},{"key":"ref27","first-page":"747","article-title":"ComPLx: A competitive primal-dual Lagrange optimization for global placement","author":"kim","year":"2012","journal-title":"Proc ACM\/IEEE Des Autom Conf"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1145\/1960397.1960420"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/2160916.2160935"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1002\/j.1538-7305.1970.tb01770.x"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1145\/981066.981071"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2002.1010236"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2001.915078"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1145\/277044.277152"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1145\/2228360.2228498"},{"key":"ref1","first-page":"110","article-title":"Two-dimensional datapath regularity extraction","author":"nijssen","year":"1996","journal-title":"Proc Workshop Logic and Architecture Synthesis"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2011.6105337"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2008.925783"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2006.888260"},{"key":"ref24","first-page":"768","article-title":"PADE: A high-performance mixed-size placer with automatic datapath extraction and evaluation through high-dimensional data learning","author":"ward","year":"2012","journal-title":"Proc ACM\/IEEE Des Autom Conf"},{"key":"ref23","first-page":"48","article-title":"An efficient and effective detailed placement algorithm","author":"pan","year":"2005","journal-title":"Proc IEEE\/ACM Int Conf Comput -Aided Des"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/ISVLSI.2007.5"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/43.784120"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/43\/6416083\/06416106.pdf?arnumber=6416106","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,1,29]],"date-time":"2025-01-29T18:55:19Z","timestamp":1738176919000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/6416106\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,2]]},"references-count":33,"journal-issue":{"issue":"2"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2012.2233862","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"value":"0278-0070","type":"print"},{"value":"1937-4151","type":"electronic"}],"subject":[],"published":{"date-parts":[[2013,2]]}}}