{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,29]],"date-time":"2025-10-29T06:11:21Z","timestamp":1761718281832},"reference-count":23,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"10","license":[{"start":{"date-parts":[[2013,10,1]],"date-time":"2013-10-01T00:00:00Z","timestamp":1380585600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2013,10]]},"DOI":"10.1109\/tcad.2013.2261436","type":"journal-article","created":{"date-parts":[[2013,9,16]],"date-time":"2013-09-16T18:02:04Z","timestamp":1379354524000},"page":"1628-1632","source":"Crossref","is-referenced-by-count":9,"title":["Theory and Analysis for Optimization of On-Chip Thermoelectric Cooling Systems"],"prefix":"10.1109","volume":"32","author":[{"given":"Jieyi","family":"Long","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Dawei","family":"Li","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Seda Ogrenci","family":"Memik","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Semail","family":"Ulgen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/STHERM.2003.1194354"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/THERMINIC.2007.4451778"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/VLSISOC.2009.6041327"},{"key":"ref13","first-page":"463","article-title":"3-D-ICE: Fast compact transient thermal modeling for 3-D ICs with intertier liquid cooling","author":"sridhar","year":"2010","journal-title":"Proc IEEE\/ACM ICCAD"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2011.2174236"},{"key":"ref15","first-page":"123","article-title":"Full-chip thermal analysis of 3-D ICs with liquid cooling by GPU-accelerated GMRES method","author":"xue-xin","year":"2012","journal-title":"Proc Int Symp Quality Electron Design (ISQED)"},{"key":"ref16","first-page":"551","article-title":"Fast thermal analysis on GPU for 3-D ICs with integrated microchannel cooling","author":"zhuo","year":"2010","journal-title":"Proc IEEE\/ACM Int Conf Comput -Aided Design"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1145\/1837274.1837419"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1017\/CBO9780511804441"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1016\/j.laa.2004.04.031"},{"key":"ref4","first-page":"117","article-title":"Optimization of an on-chip active cooling system based on thin-film thermoelectric coolers","author":"long","year":"2010","journal-title":"Proc Design Autom Test Eur"},{"key":"ref3","doi-asserted-by":"crossref","first-page":"597","DOI":"10.1038\/35098012","article-title":"Thin-film thermoelectric devices with high room-temperature figure of merit","volume":"413","author":"venkatasubramanian","year":"2001","journal-title":"Nature"},{"key":"ref6","doi-asserted-by":"crossref","DOI":"10.1007\/978-3-642-05156-2","author":"varga","year":"2000","journal-title":"Matrix Iterative Analysis"},{"key":"ref5","author":"rowe","year":"2006","journal-title":"CRC Handbook of Thermoelectrics"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1007\/s11664-009-0694-6"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1115\/1.2753959"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2008.07.017"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1038\/nnano.2008.417"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.4028\/www.scientific.net\/AMR.216.128"},{"key":"ref20","year":"2000","journal-title":"Performance Evaluation in the New Millennium"},{"key":"ref22","first-page":"83","article-title":"Wattch: a framework for architectural-level power analysis and optimizations","author":"brooks","year":"2000","journal-title":"Proceedings of 27th International Symposium on Computer Architecture (IEEE Cat No RS00201) ISCA"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2006.82"},{"key":"ref23","doi-asserted-by":"crossref","first-page":"2","DOI":"10.1145\/871656.859620","article-title":"Temperature-aware microarchitecture","author":"skadron","year":"2003","journal-title":"Proc Int Symp Comput Architect"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/43\/6600826\/06601030.pdf?arnumber=6601030","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,12,23]],"date-time":"2021-12-23T13:29:13Z","timestamp":1640266153000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6601030\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,10]]},"references-count":23,"journal-issue":{"issue":"10"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2013.2261436","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"value":"0278-0070","type":"print"},{"value":"1937-4151","type":"electronic"}],"subject":[],"published":{"date-parts":[[2013,10]]}}}