{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,20]],"date-time":"2026-06-20T15:45:46Z","timestamp":1781970346110,"version":"3.54.5"},"reference-count":26,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"12","license":[{"start":{"date-parts":[[2013,12,1]],"date-time":"2013-12-01T00:00:00Z","timestamp":1385856000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2013,12]]},"DOI":"10.1109\/tcad.2013.2277975","type":"journal-article","created":{"date-parts":[[2013,11,19]],"date-time":"2013-11-19T19:01:22Z","timestamp":1384887682000},"page":"2004-2008","source":"Crossref","is-referenced-by-count":9,"title":["Analytical Models for Three-Dimensional Ion Implantation Profiles in FinFETs"],"prefix":"10.1109","volume":"32","author":[{"given":"Liping","family":"Wang","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Andrew R.","family":"Brown","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Binjie","family":"Cheng","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Asen","family":"Asenov","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/VTSA.2008.4530845"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2011.2123100"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2008.4796833"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.5573\/JSTS.2010.10.4.265"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4615-8103-1_3"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1016\/j.nimb.2010.02.091"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-7091-8752-4"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/66.475181"},{"key":"ref18","first-page":"1259","article-title":"A computationally efficient method for three-dimensional simulation of ion implantation","volume":"e83 c","author":"burenkov","year":"2000","journal-title":"IEICE Trans Electron"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/T-ED.1981.20501"},{"key":"ref4","year":"2007","journal-title":"FinFETs and Other Multigate Transistors"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/IWJT.2010.5475000"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2007.4339747"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2002.1175825"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1116\/1.2816925"},{"key":"ref7","first-page":"17","article-title":"FinFET doping; material science, metrology, and process modeling studies for optimized device performance","volume":"1321","author":"duffy","year":"2010","journal-title":"Proc Int Conf Ion Implantation Technol AIP Conf"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1007\/s10825-009-0292-0"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1116\/1.2789439"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2010.53"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1016\/S0168-583X(87)80012-5"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1063\/1.4766527"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2009.2032621"},{"key":"ref24","doi-asserted-by":"crossref","first-page":"1484","DOI":"10.1109\/T-ED.1980.20061","article-title":"simulation of doping processes","volume":"27","author":"ryssel","year":"1980","journal-title":"IEEE Transactions on Electron Devices"},{"key":"ref23","author":"burenkov","year":"1986","journal-title":"Tables of Ion Implantation Spatial Distributions"},{"key":"ref26","author":"heinrich","year":"2004","journal-title":"A Guide to the Pearson Type IV Distribution"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1080\/00337578008209163"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/43\/6663223\/06663231.pdf?arnumber=6663231","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,11,29]],"date-time":"2021-11-29T20:40:28Z","timestamp":1638218428000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6663231\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,12]]},"references-count":26,"journal-issue":{"issue":"12"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2013.2277975","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"value":"0278-0070","type":"print"},{"value":"1937-4151","type":"electronic"}],"subject":[],"published":{"date-parts":[[2013,12]]}}}