{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T10:00:15Z","timestamp":1740132015883,"version":"3.37.3"},"reference-count":37,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"12","license":[{"start":{"date-parts":[[2016,1,1]],"date-time":"2016-01-01T00:00:00Z","timestamp":1451606400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"funder":[{"DOI":"10.13039\/100000001","name":"National Science Foundation","doi-asserted-by":"publisher","award":["CNS-1423137","CNS-1551661","CNS-1565474"],"award-info":[{"award-number":["CNS-1423137","CNS-1551661","CNS-1565474"]}],"id":[{"id":"10.13039\/100000001","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2016]]},"DOI":"10.1109\/tcad.2016.2543020","type":"journal-article","created":{"date-parts":[[2016,3,17]],"date-time":"2016-03-17T18:18:37Z","timestamp":1458238717000},"page":"2082-2092","source":"Crossref","is-referenced-by-count":9,"title":["Temperature-Constrained Feasibility Analysis for Multicore Scheduling"],"prefix":"10.1109","volume":"35","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-6255-8075","authenticated-orcid":false,"given":"Qiushi","family":"Han","sequence":"first","affiliation":[]},{"given":"Ming","family":"Fan","sequence":"additional","affiliation":[]},{"given":"Ou","family":"Bai","sequence":"additional","affiliation":[]},{"given":"Shaolei","family":"Ren","sequence":"additional","affiliation":[]},{"given":"Gang","family":"Quan","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2012.6176542"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1587\/transele.E93.C.1679"},{"journal-title":"Digital Integrated Circuits A Design Perspective","year":"2003","author":"rabaey","key":"ref31"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2010.5450539"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2005.850860"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2003.1261387"},{"journal-title":"Nonnegative Matrices in Dynamic Systems","year":"1989","author":"berman","key":"ref35"},{"journal-title":"Handbook of Exact Solutions for Ordinary Differential Equations","year":"2003","author":"polyanin","key":"ref34"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2012.213"},{"journal-title":"CPU Monitoring with DTS\/PECI","year":"2010","author":"berktold","key":"ref11"},{"journal-title":"Hotspot 4 2 temperature modeling tool","year":"2009","key":"ref12"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2006.876103"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2012.293"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2014.2312495"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ISCA.2006.39"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2008.4681627"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2011.2161308"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1145\/1391469.1391658"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/RTAS.2012.14"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1145\/859618.859620"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2010.2052057"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2009.9"},{"key":"ref6","doi-asserted-by":"crossref","first-page":"1479","DOI":"10.1109\/TCAD.2008.925793","article-title":"Three-dimensional chip-multiprocessor run-time thermal management","volume":"27","author":"zhu","year":"2008","journal-title":"IEEE Trans Comput -Aided Design Integr Circuits Syst"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1145\/2228360.2228399"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/VLSI.Design.2010.57"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2007.158"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2006.77"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2010.5434077"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1145\/2544375.2544390"},{"journal-title":"International Technology Roadmap for Semiconductors","year":"0","key":"ref1"},{"key":"ref20","first-page":"187","article-title":"Neighbor-aware dynamic thermal management for multi-core platform","author":"liu","year":"2012","journal-title":"Proc Design Autom Test Eur Conf Exhibition (DATE)"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/RTAS.2009.34"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1145\/2463209.2488952"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2009.2026357"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1145\/1837274.1837417"},{"key":"ref26","first-page":"281","article-title":"Approximation algorithm for the temperature-aware scheduling problem","author":"zhang","year":"2007","journal-title":"Proc IEEE\/ACM Int Conf Comput -Aided Design (ICCAD)"},{"key":"ref25","first-page":"185","article-title":"Predicting thermal behavior for temperature management in time-critical multicore systems","author":"yun","year":"2013","journal-title":"Proc 12th IEEE Real-Time and Embedded Technol Appl Symp (RTAS)"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/43\/7748585\/07435278.pdf?arnumber=7435278","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T16:19:27Z","timestamp":1642004367000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/7435278\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016]]},"references-count":37,"journal-issue":{"issue":"12"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2016.2543020","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"type":"print","value":"0278-0070"},{"type":"electronic","value":"1937-4151"}],"subject":[],"published":{"date-parts":[[2016]]}}}