{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T10:00:16Z","timestamp":1740132016755,"version":"3.37.3"},"reference-count":16,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"12","license":[{"start":{"date-parts":[[2016,1,1]],"date-time":"2016-01-01T00:00:00Z","timestamp":1451606400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"funder":[{"DOI":"10.13039\/100000028","name":"Semiconductor Research Corporation","doi-asserted-by":"publisher","award":["2239.0001"],"award-info":[{"award-number":["2239.0001"]}],"id":[{"id":"10.13039\/100000028","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100002418","name":"Intel Corporation","doi-asserted-by":"publisher","award":["ICSS Task 2293"],"award-info":[{"award-number":["ICSS Task 2293"]}],"id":[{"id":"10.13039\/100002418","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2016]]},"DOI":"10.1109\/tcad.2016.2550583","type":"journal-article","created":{"date-parts":[[2016,4,5]],"date-time":"2016-04-05T20:08:57Z","timestamp":1459886937000},"page":"2056-2067","source":"Crossref","is-referenced-by-count":3,"title":["More Power Reduction With 3-Tier Logic-on-Logic 3-D ICs"],"prefix":"10.1109","volume":"35","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-5243-4132","authenticated-orcid":false,"given":"Taigon","family":"Song","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shreepad","family":"Panth","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yoo-Jin","family":"Chae","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sung Kyu","family":"Lim","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2009.2034508"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1145\/1687399.1687524"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2007.373611"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2010.5510444"},{"key":"ref14","first-page":"6","article-title":"An innovative chip-to-wafer and wafer-to-wafer stacking","author":"lo","year":"2006","journal-title":"Proc 56th Electron Compon Technol Conf"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2010.5490948"},{"journal-title":"SET is Well Positioned and Prepared to Address the Challenges of the Fast Growing 3D System Integration Market","year":"2010","author":"yannou","key":"ref16"},{"key":"ref4","first-page":"1","article-title":"On GPU bus power reduction with 3D IC technologies","author":"lee","year":"2014","journal-title":"Proc Design Autom Test Eur Conf Exhibition (DATE)"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2013.6658541"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/2593069.2593167"},{"key":"ref5","first-page":"130","article-title":"8GB 3D DDR3 DRAM using through-silicon-via technology","author":"kang","year":"2009","journal-title":"IEEE Int Solid-State Circuits Conf Dig Tech Papers (ISSCC)"},{"journal-title":"OpenSPARC T2","year":"0","key":"ref8"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ISLPED.2013.6629260"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/MICRO.2006.18"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MSPEC.2011.6056626"},{"journal-title":"32\/28nm Generic Library","year":"0","key":"ref9"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/43\/7748585\/07447714.pdf?arnumber=7447714","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T16:19:28Z","timestamp":1642004368000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7447714\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016]]},"references-count":16,"journal-issue":{"issue":"12"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2016.2550583","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"type":"print","value":"0278-0070"},{"type":"electronic","value":"1937-4151"}],"subject":[],"published":{"date-parts":[[2016]]}}}