{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,7,19]],"date-time":"2024-07-19T20:34:22Z","timestamp":1721421262533},"reference-count":47,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2016,1,1]],"date-time":"2016-01-01T00:00:00Z","timestamp":1451606400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"funder":[{"name":"DAG","award":["DAG11EG05S"],"award-info":[{"award-number":["DAG11EG05S"]}]},{"name":"FSGRF","award":["FSGRF15EG04"],"award-info":[{"award-number":["FSGRF15EG04"]}]},{"name":"GRF","award":["GRF620512"],"award-info":[{"award-number":["GRF620512"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2016]]},"DOI":"10.1109\/tcad.2016.2584056","type":"journal-article","created":{"date-parts":[[2016,6,23]],"date-time":"2016-06-23T22:31:14Z","timestamp":1466721074000},"page":"1-1","source":"Crossref","is-referenced-by-count":5,"title":["Energy-Efficient Power Delivery System Paradigms for Many-Core Processors"],"prefix":"10.1109","author":[{"given":"Haoran","family":"Li","sequence":"first","affiliation":[]},{"given":"Xuan","family":"Wang","sequence":"additional","affiliation":[]},{"given":"Jiang","family":"Xu","sequence":"additional","affiliation":[]},{"given":"Zhe","family":"Wang","sequence":"additional","affiliation":[]},{"given":"Rafael","family":"Maeda","sequence":"additional","affiliation":[]},{"given":"Zhehui","family":"Wang","sequence":"additional","affiliation":[]},{"given":"Peng","family":"Yang","sequence":"additional","affiliation":[]},{"given":"Luan","family":"Duong","sequence":"additional","affiliation":[]},{"given":"Zhifei","family":"Wang","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref39","year":"2015","journal-title":"Bourns"},{"key":"ref38","year":"2015","journal-title":"Mosis Integrated Circuit Fabrication Service USC Information Sciences Institute"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/APEC.1998.647687"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/POWERENG.2007.4380181"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2010.2047451"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2010.2049374"},{"key":"ref37","year":"2015","journal-title":"Fairchild Semiconductor"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/43.905671"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2012.2196316"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2011.5898608"},{"key":"ref10","year":"0","journal-title":"International Technology Roadmap for Semiconductors Reports 2012 Update"},{"key":"ref40","year":"2015","journal-title":"Murata"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2008.28"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2012.2198891"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2012.2227821"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2007.902204"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2004.842837"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2008.917321"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2014.2306959"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2012.6176667"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2004.842831"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2007.364663"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2003.822773"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2012.2230408"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2012.2235084"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/1952998.1952999"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/PESC.2006.1712202"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2000.839850"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TMAG.2011.2116122"},{"key":"ref7","first-page":"3706","article-title":"An 800mW fully-integrated 130nm CMOS DC-DC step-down multi-phase converter, with on-chip spiral inductors and capacitors","author":"wens","year":"2009","journal-title":"Proc IEEE Energy Convers Congr Expo (ECCE)"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2013.2242094"},{"key":"ref9","first-page":"123","article-title":"System level analysis of fast, per-core DVFS using on-chip switching regulators","author":"kim","year":"2008","journal-title":"Proc Int Symp High Perform Comput Archit"},{"key":"ref1","first-page":"365","article-title":"Dark silicon and the end of multicore scaling","author":"esmaeilzadeh","year":"2011","journal-title":"2011 38th Annual International Symposium on Computer Architecture (ISCA) ISCA"},{"key":"ref46","year":"2015","journal-title":"CVX MATLAB Software for Disciplined Convex Programming"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1145\/2228360.2228372"},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.1109\/ISCA.2014.6853199"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2011.2169309"},{"key":"ref47","doi-asserted-by":"publisher","DOI":"10.1145\/1146909.1146943"},{"key":"ref21","first-page":"198","article-title":"A 82% efficiency 0.5% ripple 16-phase fully integrated capacitive voltage doubler","author":"breussegem","year":"2009","journal-title":"Proc Symp VLSI Circuits"},{"key":"ref42","year":"2015","journal-title":"Intel Xeon Processor Product Families"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/ICICDT.2006.220793"},{"key":"ref41","first-page":"432","article-title":"FIVR—Fully integrated voltage regulators on 4th generation Intel Core SoCs","author":"burton","year":"2014","journal-title":"Proc IEEE Conf Appl Power Electron Conf Expo (APEC)"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2012.2221237"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2012.6248906"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2010.2072997"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2007.358086"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2015.2413400"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/43\/6917053\/07498688.pdf?arnumber=7498688","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T16:38:10Z","timestamp":1642005490000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7498688\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016]]},"references-count":47,"URL":"https:\/\/doi.org\/10.1109\/tcad.2016.2584056","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"value":"0278-0070","type":"print"},{"value":"1937-4151","type":"electronic"}],"subject":[],"published":{"date-parts":[[2016]]}}}