{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T10:00:23Z","timestamp":1740132023152,"version":"3.37.3"},"reference-count":29,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"6","license":[{"start":{"date-parts":[[2017,6,1]],"date-time":"2017-06-01T00:00:00Z","timestamp":1496275200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"funder":[{"name":"Genesys Logic"},{"name":"IBM"},{"DOI":"10.13039\/501100004164","name":"MediaTek","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100004164","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100004368","name":"TSMC","doi-asserted-by":"crossref","id":[{"id":"10.13039\/501100004368","id-type":"DOI","asserted-by":"crossref"}]},{"DOI":"10.13039\/501100001869","name":"Academia Sinica","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100001869","id-type":"DOI","asserted-by":"publisher"}]},{"name":"MOST of Taiwan","award":["NSC 102-2221-E-002-235-MY3","NSC 102-2923-E-002-006-MY3","MOST 103-2221-E-002-259-MY3","MOST 103-2812-8-002-003","MOST 104-2221-E-002-132-MY3"],"award-info":[{"award-number":["NSC 102-2221-E-002-235-MY3","NSC 102-2923-E-002-006-MY3","MOST 103-2221-E-002-259-MY3","MOST 103-2812-8-002-003","MOST 104-2221-E-002-132-MY3"]}]},{"DOI":"10.13039\/501100006477","name":"National Taiwan University","doi-asserted-by":"publisher","award":["NTU-ERP-104R8951","NTU-ERP-105R8951"],"award-info":[{"award-number":["NTU-ERP-104R8951","NTU-ERP-105R8951"]}],"id":[{"id":"10.13039\/501100006477","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2017,6]]},"DOI":"10.1109\/tcad.2016.2614777","type":"journal-article","created":{"date-parts":[[2016,10,3]],"date-time":"2016-10-03T18:17:47Z","timestamp":1475518667000},"page":"964-977","source":"Crossref","is-referenced-by-count":1,"title":["Nanowire-Aware Routing Considering High Cut Mask Complexity"],"prefix":"10.1109","volume":"36","author":[{"given":"Yu-Hsuan","family":"Su","sequence":"first","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0564-5719","authenticated-orcid":false,"given":"Yao-Wen","family":"Chang","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2012.6165047"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2014.6742880"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2010.2076305"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1117\/1.JMM.11.3.031303"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2005.847902"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.5772\/1025"},{"journal-title":"International Technology Roadmap for Semiconductors","year":"2015","key":"ref16"},{"key":"ref17","doi-asserted-by":"crossref","first-page":"2548","DOI":"10.1016\/S1452-3981(23)07946-4","article-title":"Preparation and structural characterization of template assisted electrodeposited copper nanowires","volume":"9","author":"irshad","year":"2014","journal-title":"Int J Electrochem Sci"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1016\/j.mattod.2013.11.002"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2002.1013891"},{"key":"ref28","article-title":"DSA template mask determination and cut redistribution for advanced 1D gridded design","volume":"888017","author":"xiao","year":"2013","journal-title":"Proc SPIE"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2004.826547"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1021\/nn501300b"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2014.7001407"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/1118299.1118448"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2006.881822"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2006.884492"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2008.2009156"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2008.917597"},{"article-title":"EUV lithography at insertion and beyond","year":"0","author":"borodovsky","key":"ref2"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2001.968655"},{"article-title":"Multiple patterning for immersion extension and EUV insertion","year":"0","author":"bencher","key":"ref1"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2010.5654184"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1145\/774572.774579"},{"key":"ref21","first-page":"44","article-title":"Scope and limit of lithography to the end of Moore’s law","author":"lin","year":"2012","journal-title":"Proc ISPD"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1145\/2593069.2593176"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1145\/2872334.2872350"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1145\/2744769.2744874"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TCS.1979.1084652"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/43\/7931742\/07581059.pdf?arnumber=7581059","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,8,20]],"date-time":"2023-08-20T09:34:44Z","timestamp":1692524084000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7581059\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,6]]},"references-count":29,"journal-issue":{"issue":"6"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2016.2614777","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"type":"print","value":"0278-0070"},{"type":"electronic","value":"1937-4151"}],"subject":[],"published":{"date-parts":[[2017,6]]}}}