{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,25]],"date-time":"2026-06-25T09:18:42Z","timestamp":1782379122649,"version":"3.54.5"},"reference-count":33,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"9","license":[{"start":{"date-parts":[[2017,9,1]],"date-time":"2017-09-01T00:00:00Z","timestamp":1504224000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"funder":[{"DOI":"10.13039\/501100003725","name":"National Research Foundation of Korea by the Korea Government (MSIP)","doi-asserted-by":"publisher","award":["2015R1A2A2A01008037"],"award-info":[{"award-number":["2015R1A2A2A01008037"]}],"id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2017,9]]},"DOI":"10.1109\/tcad.2016.2629419","type":"journal-article","created":{"date-parts":[[2016,11,17]],"date-time":"2016-11-17T14:55:26Z","timestamp":1479394526000},"page":"1522-1531","source":"Crossref","is-referenced-by-count":4,"title":["Fast Verification of Guide-Patterns for Directed Self-Assembly Lithography"],"prefix":"10.1109","volume":"36","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-5864-3111","authenticated-orcid":false,"given":"Seongbo","family":"Shim","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Youngsoo","family":"Shin","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1117\/1.JMM.15.3.031610"},{"key":"ref32","first-page":"1","article-title":"Directed self-assembly (DSA) grapho-epitaxy template generation with immersion lithography","author":"ma","year":"2015","journal-title":"Proc SPIE Adv Lithography"},{"key":"ref31","first-page":"1","article-title":"Compact model experimental validation for grapho-epitaxy hole processes and its impact in mask making tolerances","author":"fenger","year":"2014","journal-title":"Proc SPIE Adv Lithography"},{"key":"ref30","first-page":"1","article-title":"Physical verification and manufacturing of contact\/via layers using grapho-epitaxy DSA processes","author":"torres","year":"2014","journal-title":"Proc SPIE Adv Lithography"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1117\/12.2011264"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.7567\/JJAP.53.06JC01"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1002\/polb.23452"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1117\/12.814258"},{"key":"ref14","year":"2013","journal-title":"Calibre NmOPC Manual"},{"key":"ref15","year":"2013","journal-title":"Calibre OPCverify Manual"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1117\/12.657139"},{"key":"ref17","first-page":"1","article-title":"Litho-friendly design (LfD) methodologies applied to library cells","author":"peter","year":"2013","journal-title":"Proc SPIE Adv Lithography"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1117\/12.2015173"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2013.6691117"},{"key":"ref28","year":"2014","journal-title":"Personal communication"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1117\/12.2011263"},{"key":"ref27","first-page":"128","article-title":"Yield enhancement with DFM","author":"paek","year":"2012","journal-title":"Proc SPIE Adv Lithography"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1117\/1.JMM.12.3.033011"},{"key":"ref6","first-page":"1","article-title":"A full-chip DSA correction framework","author":"wang","year":"2014","journal-title":"Proc SPIE Adv Lithography"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2015.7059081"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1117\/12.2011575"},{"key":"ref8","first-page":"1","article-title":"Calibration and application of a DSA compact model for graphoepitaxy hole processes using contour-based metrology","author":"fenger","year":"2014","journal-title":"Proc SPIE Adv Lithography"},{"key":"ref7","first-page":"83","article-title":"Mask optimization for directed self-assembly lithography: Inverse DSA and inverse lithography","author":"shim","year":"2016","journal-title":"Proc Asia&#x2013;South Pac Design Autom Conf"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1117\/1.JMM.11.3.031305"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1145\/2593069.2593125"},{"key":"ref1","first-page":"1","article-title":"Verification of directed self-assembly (DSA) guide patterns through machine learning","author":"shim","year":"2015","journal-title":"Proc SPIE Adv Lithography"},{"key":"ref20","year":"2015","journal-title":"Nangate open cell library"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1117\/12.917402"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1117\/12.2012440"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1162\/0899766053491896"},{"key":"ref23","author":"jolliffe","year":"2002","journal-title":"Principal Component Analysis"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1137\/030601338"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1214\/009053607000000677"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/43\/8013181\/07747438.pdf?arnumber=7747438","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T11:41:17Z","timestamp":1641987677000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7747438\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,9]]},"references-count":33,"journal-issue":{"issue":"9"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2016.2629419","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"value":"0278-0070","type":"print"},{"value":"1937-4151","type":"electronic"}],"subject":[],"published":{"date-parts":[[2017,9]]}}}