{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,21]],"date-time":"2026-07-21T14:24:46Z","timestamp":1784643886411,"version":"3.55.0"},"reference-count":31,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"7","license":[{"start":{"date-parts":[[2018,7,1]],"date-time":"2018-07-01T00:00:00Z","timestamp":1530403200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"funder":[{"DOI":"10.13039\/501100000038","name":"Natural Sciences and Engineering Research Council of Canada","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100000038","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100007053","name":"Mentor Graphics Corporation","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100007053","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2018,7]]},"DOI":"10.1109\/tcad.2017.2666723","type":"journal-article","created":{"date-parts":[[2017,2,9]],"date-time":"2017-02-09T19:17:31Z","timestamp":1486667851000},"page":"1317-1330","source":"Crossref","is-referenced-by-count":96,"title":["Power Grid Electromigration Checking Using Physics-Based Models"],"prefix":"10.1109","volume":"37","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-9874-3969","authenticated-orcid":false,"given":"Sandeep","family":"Chatterjee","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Valeriy","family":"Sukharev","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Farid N.","family":"Najm","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/RELPHY.2001.922925"},{"key":"ref30","doi-asserted-by":"crossref","first-page":"101","DOI":"10.1214\/ss\/1009213286","article-title":"Interval estimation for a binomial proportion","volume":"16","author":"brown","year":"2001","journal-title":"Stat Sci"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1063\/1.354073"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1063\/1.1330547"},{"key":"ref12","doi-asserted-by":"crossref","first-page":"118","DOI":"10.1109\/TVLSI.2014.2301458","article-title":"A method for improving power grid resilience to electromigration-caused via failures","volume":"23","author":"li","year":"2015","journal-title":"IEEE Trans Very Large Scale Integr (VLSI) Syst"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1016\/j.vlsi.2016.04.001"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2014.2358678"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1145\/2966986.2967041"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2008.4483978"},{"key":"ref17","first-page":"24","article-title":"Impact of via-line contact on Cu interconnect electromigration performance","author":"li","year":"2005","journal-title":"Proc IEEE Int Rel Phys Symp"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/7298.946458"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1063\/1.348738"},{"key":"ref28","author":"weiss","year":"2005","journal-title":"A Course in Probability"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2013.6531951"},{"key":"ref27","author":"miller","year":"1990","journal-title":"Probability and statistics for engineers"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/T-ED.1969.16754"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1063\/1.322842"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.6028\/jres.070C.025"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2007.07.094"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2013.6691168"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1063\/1.1585119"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/IITC-AMC.2016.7507680"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1145\/2593069.2593180"},{"key":"ref1","first-page":"464","article-title":"Circuit design challenges at the 14nm technology node","author":"warnock","year":"2011","journal-title":"Proc 48th ACM\/EDAC\/IEEE Design Autom Conf (DAC)"},{"key":"ref20","author":"schiesser","year":"1994","journal-title":"Computational Mathematics in Engineering and Applied Science ODEs DAEs and PDEs"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2015.2508447"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1016\/j.spl.2008.09.006"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/43.712099"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1137\/1.9780898717778"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/RELPHY.1993.283282"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2006.876103"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/43\/8387697\/07849192.pdf?arnumber=7849192","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T16:22:49Z","timestamp":1642004569000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/7849192\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,7]]},"references-count":31,"journal-issue":{"issue":"7"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2017.2666723","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"value":"0278-0070","type":"print"},{"value":"1937-4151","type":"electronic"}],"subject":[],"published":{"date-parts":[[2018,7]]}}}