{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T02:25:52Z","timestamp":1781835952751,"version":"3.54.5"},"reference-count":18,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"12","license":[{"start":{"date-parts":[[2017,12,1]],"date-time":"2017-12-01T00:00:00Z","timestamp":1512086400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2017,12]]},"DOI":"10.1109\/tcad.2017.2681068","type":"journal-article","created":{"date-parts":[[2017,3,10]],"date-time":"2017-03-10T21:23:40Z","timestamp":1489181020000},"page":"2080-2092","source":"Crossref","is-referenced-by-count":14,"title":["Multiple Patterning Layout Decomposition Considering Complex Coloring Rules and Density Balancing"],"prefix":"10.1109","volume":"36","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-4554-3442","authenticated-orcid":false,"given":"Iris Hui-Ru","family":"Jiang","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hua-Yu","family":"Chang","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2013.6691114"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1145\/2463209.2488818"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1145\/2764904"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2013.2288678"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2014.2387840"},{"key":"ref15","first-page":"1","article-title":"Triple\/quadruple patterning layout decomposition via novel linear programming and iterative rounding","volume":"9781","author":"lin","year":"2016","journal-title":"Proc SPIE Design-Process-Technol Co-Optim Manufacturability X"},{"key":"ref16","first-page":"1","article-title":"Layout decomposition for quadruple patterning lithography and beyond","author":"yu","year":"2014","journal-title":"Proc ACM\/IEEE Design Autom Conf (DAC)"},{"key":"ref17","author":"knuth","year":"2000","journal-title":"Dancing Links"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1145\/2897937.2898048"},{"key":"ref4","author":"dorsch","year":"2015","journal-title":"Changes and Challenges Abound in Multi-Patterning Lithography Semiconductor Manufacturing and Design (SemiMD)"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1145\/2872334.2878630"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2011.6105298"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2010.2048374"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1145\/2429384.2429396"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1117\/12.793116"},{"key":"ref2","article-title":"Layout optimization for integrated circuit design","author":"chen","year":"2015"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1515\/aot-2015-0036"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2015.2401571"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/43\/8114692\/07875427.pdf?arnumber=7875427","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T11:39:13Z","timestamp":1641987553000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7875427\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,12]]},"references-count":18,"journal-issue":{"issue":"12"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2017.2681068","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"value":"0278-0070","type":"print"},{"value":"1937-4151","type":"electronic"}],"subject":[],"published":{"date-parts":[[2017,12]]}}}