{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T16:05:05Z","timestamp":1781885105139,"version":"3.54.5"},"reference-count":37,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"8","license":[{"start":{"date-parts":[[2017,8,1]],"date-time":"2017-08-01T00:00:00Z","timestamp":1501545600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61674133"],"award-info":[{"award-number":["61674133"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61404123"],"award-info":[{"award-number":["61404123"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003995","name":"Anhui Provincial Natural Science Foundation, China","doi-asserted-by":"publisher","award":["1508085MF134"],"award-info":[{"award-number":["1508085MF134"]}],"id":[{"id":"10.13039\/501100003995","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100004853","name":"Chinese University of Hong Kong Direct Grant for Research","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100004853","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2017,8]]},"DOI":"10.1109\/tcad.2017.2681080","type":"journal-article","created":{"date-parts":[[2017,3,11]],"date-time":"2017-03-11T02:23:40Z","timestamp":1489199020000},"page":"1287-1300","source":"Crossref","is-referenced-by-count":26,"title":["Clustered Fault Tolerance TSV Planning for 3-D Integrated Circuits"],"prefix":"10.1109","volume":"36","author":[{"given":"Qi","family":"Xu","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0341-3428","authenticated-orcid":false,"given":"Song","family":"Chen","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xiaodong","family":"Xu","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Bei","family":"Yu","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/DFTVS.2005.28"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2009.5173329"},{"key":"ref31","first-page":"838","article-title":"Factors affecting copper filling process within high aspect ratio deep vias for 3D chip stacking","author":"kim","year":"2006","journal-title":"Proc IEEE Electron Compon Technol Conf"},{"key":"ref30","author":"ahuja","year":"1993","journal-title":"Network Flows Theory Algorithms and Applications"},{"key":"ref37","author":"makhorin","year":"2008","journal-title":"GLPK (GNU Linear Programming Kit)"},{"key":"ref36","author":"mehlhorn","year":"1999","journal-title":"LEDA A Platform for Combinatorial and Geometric Computing"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/92.748202"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/5.705525"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2012.6176602"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2014.2385759"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2015.7372585"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2010.5450513"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ATS.2011.37"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2011.2107924"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2012.2228742"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.7873\/DATE.2015.0268"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1145\/2228360.2228545"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1145\/2024724.2024873"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1587\/transfun.E92.A.1080"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2012.6165052"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2010.5537404"},{"key":"ref3","year":"2008","journal-title":"International Technology Roadmap for Semiconductors"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2007.4397269"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1587\/transfun.E93.A.2372"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2009.125"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2010.5654160"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/VDAT.2010.5496702"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2001.930044"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1145\/1687399.1687524"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1145\/337292.337394"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2010.2050012"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2013.2246876"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2012.2190537"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2008.4681638"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2004.1329460"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2008.917968"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1016\/j.vlsi.2010.04.001"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/43\/7982827\/07875426.pdf?arnumber=7875426","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T16:22:08Z","timestamp":1642004528000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7875426\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,8]]},"references-count":37,"journal-issue":{"issue":"8"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2017.2681080","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"value":"0278-0070","type":"print"},{"value":"1937-4151","type":"electronic"}],"subject":[],"published":{"date-parts":[[2017,8]]}}}