{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,19]],"date-time":"2026-02-19T17:30:54Z","timestamp":1771522254240,"version":"3.50.1"},"reference-count":33,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"11","license":[{"start":{"date-parts":[[2019,11,1]],"date-time":"2019-11-01T00:00:00Z","timestamp":1572566400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,11,1]],"date-time":"2019-11-01T00:00:00Z","timestamp":1572566400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,11,1]],"date-time":"2019-11-01T00:00:00Z","timestamp":1572566400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61176024"],"award-info":[{"award-number":["61176024"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61501116"],"award-info":[{"award-number":["61501116"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61871115"],"award-info":[{"award-number":["61871115"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Project on the Integration of Industry, Education, and Research of Jiangsu Province","award":["BY2015069-05"],"award-info":[{"award-number":["BY2015069-05"]}]},{"name":"Jiangsu Provincial NSF for Excellent Young Scholars"},{"DOI":"10.13039\/501100010023","name":"Natural Science Research of Jiangsu Higher Education Institutions of China","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100010023","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Collaborative Innovation Center of Solid-State Lighting and Energy-Saving Electronics"},{"DOI":"10.13039\/501100002663","name":"Northwestern Polytechnical University","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100002663","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2019,11]]},"DOI":"10.1109\/tcad.2018.2878178","type":"journal-article","created":{"date-parts":[[2018,10,25]],"date-time":"2018-10-25T21:37:00Z","timestamp":1540503420000},"page":"2139-2152","source":"Crossref","is-referenced-by-count":9,"title":["Thermal Sensor Placement and Thermal Reconstruction Under Gaussian and Non-Gaussian Sensor Noises for 3-D NoC"],"prefix":"10.1109","volume":"38","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-1351-5460","authenticated-orcid":false,"given":"Yuxiang","family":"Fu","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Li","family":"Li","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7181-8278","authenticated-orcid":false,"given":"Hongbing","family":"Pan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kun","family":"Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Fan","family":"Feng","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Qinyu","family":"Chen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7736-6487","authenticated-orcid":false,"given":"Chuan","family":"Zhang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref33","first-page":"68","article-title":"Dual-DLL-based CMOS all-digital temperature sensor for microprocessor thermal monitoring","author":"woo","year":"2009","journal-title":"Proc ISSCC"},{"key":"ref32","year":"2006","journal-title":"Processor 900 Sequence and Intel Pentium Processor Extreme Edition 955 Datasheet On 65 nm Process in the 775-Land LGA Package and Supporting Intel Extended Memory 64 Technology and Supporting Intel Virtualization Technology"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2010.2104016"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2011.2161783"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2010.2061310"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1145\/2228360.2228475"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1016\/j.vlsi.2011.12.003"},{"key":"ref13","first-page":"1","article-title":"Minimal sparse observability of complex networks: Application to MPSoC sensor placement and run-time thermal estimation & tracking","author":"sarma","year":"2014","journal-title":"Proc DATE"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/APCCAS.2016.7803935"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2013.2280667"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2014.2302384"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.7873\/DATE.2013.285"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2010.2051567"},{"key":"ref19","doi-asserted-by":"crossref","first-page":"1479","DOI":"10.1109\/TCAD.2008.925793","article-title":"Three-dimensional chip-multiprocessor run-time thermal management","volume":"27","author":"zhu","year":"2008","journal-title":"IEEE Trans Comput -Aided Design Integr Circuits Syst"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2004.839472"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TPDS.2014.2308206"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2007.4378783"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/MICRO.2004.35"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISSoC.2013.6675281"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2014.2344112"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.compeleceng.2011.12.006"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2011.45"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1145\/2501626.2512468"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2006.876103"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1145\/1837274.1837291"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2007.893649"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2017.2661808"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TCNS.2015.2453711"},{"key":"ref21","author":"chen","year":"1998","journal-title":"Linear System Theory and Design"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2009.2013990"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1007\/BF01588971"},{"key":"ref26","author":"fazzino","year":"2008","journal-title":"Noxim Network-on-chip simulator"},{"key":"ref25","first-page":"135","article-title":"Traffic-thermal mutual-coupling co-simulation platform for three-dimensional network-on-chip","author":"jheng","year":"2010","journal-title":"Proc Int Symp VLSI-DAT"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/43\/8877482\/08509129.pdf?arnumber=8509129","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,13]],"date-time":"2022-07-13T21:08:51Z","timestamp":1657746531000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8509129\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,11]]},"references-count":33,"journal-issue":{"issue":"11"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2018.2878178","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"value":"0278-0070","type":"print"},{"value":"1937-4151","type":"electronic"}],"subject":[],"published":{"date-parts":[[2019,11]]}}}