{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T10:00:03Z","timestamp":1740132003824,"version":"3.37.3"},"reference-count":36,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2020,4,1]],"date-time":"2020-04-01T00:00:00Z","timestamp":1585699200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2020,4,1]],"date-time":"2020-04-01T00:00:00Z","timestamp":1585699200000},"content-version":"am","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2020,4,1]],"date-time":"2020-04-01T00:00:00Z","timestamp":1585699200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2020,4,1]],"date-time":"2020-04-01T00:00:00Z","timestamp":1585699200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100008982","name":"National Science Foundation","doi-asserted-by":"publisher","award":["CCF-1527324","CCF-1816361"],"award-info":[{"award-number":["CCF-1527324","CCF-1816361"]}],"id":[{"id":"10.13039\/501100008982","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100000185","name":"Defense Advanced Research Projects Agency","doi-asserted-by":"publisher","award":["HR0011-16-2-0009"],"award-info":[{"award-number":["HR0011-16-2-0009"]}],"id":[{"id":"10.13039\/100000185","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2020,4]]},"DOI":"10.1109\/tcad.2019.2907908","type":"journal-article","created":{"date-parts":[[2019,3,27]],"date-time":"2019-03-27T21:50:11Z","timestamp":1553723411000},"page":"885-894","source":"Crossref","is-referenced-by-count":8,"title":["Accelerating Electromigration Aging: Fast Failure Detection for Nanometer ICs"],"prefix":"10.1109","volume":"39","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-7474-3366","authenticated-orcid":false,"given":"Sheriff","family":"Sadiqbatcha","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7465-1824","authenticated-orcid":false,"given":"Zeyu","family":"Sun","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2119-6869","authenticated-orcid":false,"given":"Sheldon X.-D.","family":"Tan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2012.2233201"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2018.8297392"},{"journal-title":"Effects of Scaling and Grain Structure on Electromigration Reliability of Cu Interconnects","year":"2010","author":"zhang","key":"ref31"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/RELPHY.2004.1315327"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/SMACD.2018.8434891"},{"journal-title":"Synopsys University Program and Resources","year":"0","key":"ref35"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2017.2682925"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2014.7001387"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2016.2523898"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2016.2524540"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1145\/2897937.2898070"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1145\/2966986.2967083"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2016.7428018"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1016\/j.vlsi.2016.10.007"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2017.2666723"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1016\/j.vlsi.2017.08.009"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2018.2801221"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2017.8203861"},{"key":"ref4","first-page":"15","author":"wolpert","year":"2012","journal-title":"Temperature Effects in Semiconductors"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1063\/1.354073"},{"journal-title":"Reliability and Failure of Electronic Materials and Devices","year":"1998","author":"ohring","key":"ref3"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1063\/1.322842"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/IPFA.2008.4588207"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/T-ED.1969.16754"},{"journal-title":"VLSI Systems Long-Term Reliability–Modeling Simulation and Optimization","year":"2019","author":"tan","key":"ref8"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2013.6531951"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/IIRW.2017.8361202"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1145\/2593069.2593180"},{"journal-title":"International Technology Roadmap for Semiconductors (ITRS)","year":"2015","key":"ref1"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2018.2861358"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2010.01.007"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2018.2800707"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2012.2190605"},{"journal-title":"Electromigration of Damascene copper for IC interconnect","year":"2004","author":"meyer","key":"ref23"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2017.2746660"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2015.2508447"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"https:\/\/ieeexplore.ieee.org\/ielam\/43\/9042369\/8675443-aam.pdf","content-type":"application\/pdf","content-version":"am","intended-application":"syndication"},{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/43\/9042369\/08675443.pdf?arnumber=8675443","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,4,27]],"date-time":"2022-04-27T14:02:53Z","timestamp":1651068173000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8675443\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,4]]},"references-count":36,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2019.2907908","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"type":"print","value":"0278-0070"},{"type":"electronic","value":"1937-4151"}],"subject":[],"published":{"date-parts":[[2020,4]]}}}