{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T10:00:11Z","timestamp":1740132011322,"version":"3.37.3"},"reference-count":1,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"1","license":[{"start":{"date-parts":[[2020,1,1]],"date-time":"2020-01-01T00:00:00Z","timestamp":1577836800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2020,1,1]],"date-time":"2020-01-01T00:00:00Z","timestamp":1577836800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2020,1,1]],"date-time":"2020-01-01T00:00:00Z","timestamp":1577836800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2020,1]]},"DOI":"10.1109\/tcad.2019.2944583","type":"journal-article","created":{"date-parts":[[2019,12,24]],"date-time":"2019-12-24T04:25:55Z","timestamp":1577161555000},"page":"277-277","source":"Crossref","is-referenced-by-count":0,"title":["Correction to \u201cAnalytical Thermal Model for Self-Heating in Advanced FinFET Devices With Implications for Design and Reliability\u201d"],"prefix":"10.1109","volume":"39","author":[{"given":"Chuan","family":"Xu","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Seshadri K.","family":"Kolluri","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3517-3580","authenticated-orcid":false,"given":"Kazhuhiko","family":"Endo","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5344-0921","authenticated-orcid":false,"given":"Kaustav","family":"Banerjee","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"crossref","first-page":"1045","DOI":"10.1109\/TCAD.2013.2248194","article-title":"Analytical thermal model for self-heating in advanced FinFET devices with implications for design and reliability","volume":"32","author":"xu","year":"2013","journal-title":"IEEE Trans Comput -Aided Design Integr Circuits Syst"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/43\/8939296\/08939318.pdf?arnumber=8939318","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,4,27]],"date-time":"2022-04-27T14:04:55Z","timestamp":1651068295000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8939318\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,1]]},"references-count":1,"journal-issue":{"issue":"1"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2019.2944583","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"type":"print","value":"0278-0070"},{"type":"electronic","value":"1937-4151"}],"subject":[],"published":{"date-parts":[[2020,1]]}}}