{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,5]],"date-time":"2026-03-05T15:33:18Z","timestamp":1772724798632,"version":"3.50.1"},"reference-count":49,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2022,4,1]],"date-time":"2022-04-01T00:00:00Z","timestamp":1648771200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2022,4,1]],"date-time":"2022-04-01T00:00:00Z","timestamp":1648771200000},"content-version":"am","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2022,4,1]],"date-time":"2022-04-01T00:00:00Z","timestamp":1648771200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,4,1]],"date-time":"2022-04-01T00:00:00Z","timestamp":1648771200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100000001","name":"NSF CRI","doi-asserted-by":"publisher","award":["1730316"],"award-info":[{"award-number":["1730316"]}],"id":[{"id":"10.13039\/100000001","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100000001","name":"NSF CRI","doi-asserted-by":"publisher","award":["1730003"],"award-info":[{"award-number":["1730003"]}],"id":[{"id":"10.13039\/100000001","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100000001","name":"NSF CRI","doi-asserted-by":"publisher","award":["1730389"],"award-info":[{"award-number":["1730389"]}],"id":[{"id":"10.13039\/100000001","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2022,4]]},"DOI":"10.1109\/tcad.2021.3079166","type":"journal-article","created":{"date-parts":[[2021,5,11]],"date-time":"2021-05-11T20:08:53Z","timestamp":1620763733000},"page":"1048-1061","source":"Crossref","is-referenced-by-count":27,"title":["PACT: An Extensible Parallel Thermal Simulator for Emerging Integration and Cooling Technologies"],"prefix":"10.1109","volume":"41","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-2403-7011","authenticated-orcid":false,"given":"Zihao","family":"Yuan","sequence":"first","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3453-7012","authenticated-orcid":false,"given":"Prachi","family":"Shukla","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8700-5258","authenticated-orcid":false,"given":"Sofiane","family":"Chetoui","sequence":"additional","affiliation":[]},{"given":"Sean","family":"Nemtzow","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8232-4516","authenticated-orcid":false,"given":"Sherief","family":"Reda","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6554-088X","authenticated-orcid":false,"given":"Ayse K.","family":"Coskun","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2006.879797"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ISLPED.2019.8824965"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1145\/859619.859620"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2013.127"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2008.4681639"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2019.2902355"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2013.6691127"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1145\/3316781.3326334"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2011.156"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/VTSA.2007.378923"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1080\/00207166808803028"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.23919\/DATE48585.2020.9116480"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2019.8757412"},{"key":"ref14","volume-title":"Semiconductor Device Modeling With SPICE","volume":"21","author":"Massobrio","year":"1993"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1142\/9781860949630_0021"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-642-11802-9_11"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.23919\/DATE.2019.8715036"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1145\/2063384.2063454"},{"key":"ref19","first-page":"469","article-title":"McPAT: An integrated power, area, and timing modeling framework for multicore and manycore architectures","volume-title":"Proc. 42nd IEEE\/ACM Annu. Int. Symp. Microarchit. (MICRO)","author":"Li"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.23919\/DATE.2018.8342238"},{"key":"ref21","first-page":"490","article-title":"On-line thermal aware dynamic voltage scaling for energy optimization with frequency\/temperature dependency consideration","volume-title":"Proc. 46th ACM\/IEEE Design Autom. Conf.","author":"Bao"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2009.136"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TPDS.2008.111"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TPDS.2009.27"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1016\/j.suscom.2011.06.005"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1145\/2934583.2934592"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TADVP.2009.2035999"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/VLSISOC.2009.6041327"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1038\/nnano.2008.417"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2012.6231419"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1145\/1089014.1089017"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD45719.2019.8942159"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2013.2293422"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1166\/jolpe.2008.272"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2006.882594"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2014.2309617"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2001.968613"},{"key":"ref38","first-page":"357","article-title":"SPICE-compatible thermal simulation with lumped circuit modeling for thermal reliability analysis based on modeling order reduction","volume-title":"Proc. 5th Int. Symp. Qual. Electron. Design (ISQUED)","author":"Wang"},{"key":"ref39","volume-title":"Open MPI: Open Source High Performance Computing","year":"2014"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1155\/2012\/713587"},{"key":"ref41","first-page":"648","article-title":"Optimizing energy efficiency of 3-D multicore systems with stacked DRAM under power and thermal constraints","volume-title":"Proc. Design Autom. Conf. (DAC)","author":"Meng"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1137\/1.9780898718027"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1145\/2966986.2967045"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1145\/3299874.3319485"},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2010.2079450"},{"key":"ref46","article-title":"Hpccg solver package","author":"Heroux","year":"2007"},{"key":"ref47","article-title":"Ubiquitous high performance computing: Challenge problems specification","author":"Campbell","year":"2012"},{"key":"ref48","doi-asserted-by":"publisher","DOI":"10.1177\/109434209100500306"},{"key":"ref49","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2020.3037327"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"https:\/\/ieeexplore.ieee.org\/ielam\/43\/9737555\/9428622-aam.pdf","content-type":"application\/pdf","content-version":"am","intended-application":"syndication"},{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/43\/9737555\/09428622.pdf?arnumber=9428622","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,9]],"date-time":"2024-01-09T22:43:29Z","timestamp":1704840209000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9428622\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,4]]},"references-count":49,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2021.3079166","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"value":"0278-0070","type":"print"},{"value":"1937-4151","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022,4]]}}}