{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,20]],"date-time":"2026-02-20T01:57:53Z","timestamp":1771552673618,"version":"3.50.1"},"reference-count":31,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"5","license":[{"start":{"date-parts":[[2022,5,1]],"date-time":"2022-05-01T00:00:00Z","timestamp":1651363200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2022,5,1]],"date-time":"2022-05-01T00:00:00Z","timestamp":1651363200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,5,1]],"date-time":"2022-05-01T00:00:00Z","timestamp":1651363200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100012166","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","award":["2019YFB2204800"],"award-info":[{"award-number":["2019YFB2204800"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61904047"],"award-info":[{"award-number":["61904047"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61874102"],"award-info":[{"award-number":["61874102"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61732020"],"award-info":[{"award-number":["61732020"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61931008"],"award-info":[{"award-number":["61931008"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["U19A2074"],"award-info":[{"award-number":["U19A2074"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100002367","name":"Strategic Priority Research Program of Chinese Academy of Sciences","doi-asserted-by":"publisher","award":["XDB44000000"],"award-info":[{"award-number":["XDB44000000"]}],"id":[{"id":"10.13039\/501100002367","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100012226","name":"Fundamental Research Funds for the Central Universities","doi-asserted-by":"publisher","award":["JZ2019HGBZ0159"],"award-info":[{"award-number":["JZ2019HGBZ0159"]}],"id":[{"id":"10.13039\/501100012226","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2022,5]]},"DOI":"10.1109\/tcad.2021.3084920","type":"journal-article","created":{"date-parts":[[2021,5,31]],"date-time":"2021-05-31T20:09:36Z","timestamp":1622491776000},"page":"1196-1208","source":"Crossref","is-referenced-by-count":6,"title":["Cellular Structure-Based Fault-Tolerance TSV Configuration in 3D-IC"],"prefix":"10.1109","volume":"41","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-0375-9800","authenticated-orcid":false,"given":"Qi","family":"Xu","sequence":"first","affiliation":[{"name":"School of Microelectronics, University of Science and Technology of China, Hefei, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wenhao","family":"Sun","sequence":"additional","affiliation":[{"name":"School of Microelectronics, University of Science and Technology of China, Hefei, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0341-3428","authenticated-orcid":false,"given":"Song","family":"Chen","sequence":"additional","affiliation":[{"name":"School of Microelectronics, University of Science and Technology of China, Hefei, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5487-6855","authenticated-orcid":false,"given":"Yi","family":"Kang","sequence":"additional","affiliation":[{"name":"School of Microelectronics, University of Science and Technology of China, Hefei, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8305-604X","authenticated-orcid":false,"given":"Xiaoqing","family":"Wen","sequence":"additional","affiliation":[{"name":"Department of Computer Science and Networks, Kyushu Institute of Technology, Kitakyushu, Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1145\/337292.337394"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2001.930044"},{"key":"ref3","volume-title":"ITRS","year":"2011"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2017.2666604"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2012.6165052"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2009.125"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2007.4397269"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/VDAT.2010.5496702"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2010.5654160"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2012.6176602"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2011.2107924"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2012.2228742"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2016.2558514"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2017.2681080"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2019.2946243"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2018.2876906"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TR.2018.2864591"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2019.2927485"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2018.2824284"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2006.1645755"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2009.5173329"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2015.7372585"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/ATS.2011.37"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/5.705525"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-02378-6"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2007.382333"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1145\/1868237.1868241"},{"key":"ref28","volume-title":"Network Flows: Theory, Algorithms, and Applications","author":"Ahuja","year":"1993"},{"key":"ref29","volume-title":"Gurobi Optimizer Reference Manual","year":"2014"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1007\/3-540-63165-8_161"},{"key":"ref31","first-page":"674","article-title":"A study of through-silicon-via impact on the 3D stacked IC layout","volume-title":"Proc. IEEE\/ACM Int. Conf. Comput.-Aided Design (ICCAD)","author":"Kim"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/43\/9760497\/09444346.pdf?arnumber=9444346","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,9]],"date-time":"2024-01-09T23:03:10Z","timestamp":1704841390000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9444346\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,5]]},"references-count":31,"journal-issue":{"issue":"5"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2021.3084920","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"value":"0278-0070","type":"print"},{"value":"1937-4151","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022,5]]}}}