{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,1]],"date-time":"2026-06-01T23:43:31Z","timestamp":1780357411847,"version":"3.54.1"},"reference-count":32,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"8","license":[{"start":{"date-parts":[[2022,8,1]],"date-time":"2022-08-01T00:00:00Z","timestamp":1659312000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2022,8,1]],"date-time":"2022-08-01T00:00:00Z","timestamp":1659312000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,8,1]],"date-time":"2022-08-01T00:00:00Z","timestamp":1659312000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"Higher Education Commission, Government of Pakistan, through the Scholarship Program titled \u201cHRDI Program of Faculty Development for UESTPs\/UETs\u201d"},{"DOI":"10.13039\/501100003725","name":"BK21 Fostering Outstanding Universities for Research (FOUR) funded by the Ministry of Education (MOE), South Korea, and National Research Foundation of Korea","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2022,8]]},"DOI":"10.1109\/tcad.2021.3110739","type":"journal-article","created":{"date-parts":[[2021,9,6]],"date-time":"2021-09-06T20:38:25Z","timestamp":1630960705000},"page":"2728-2738","source":"Crossref","is-referenced-by-count":11,"title":["Highly Efficient Test Architecture for Low-Power AI Accelerators"],"prefix":"10.1109","volume":"41","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-4063-9525","authenticated-orcid":false,"given":"Muhammad","family":"Ibtesam","sequence":"first","affiliation":[{"name":"Department of Computer Science and Engineering, Hanyang University, Seoul, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5336-7496","authenticated-orcid":false,"given":"Umair Saeed","family":"Solangi","sequence":"additional","affiliation":[{"name":"Department of Computer Science and Engineering, Hanyang University, Seoul, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5663-3307","authenticated-orcid":false,"given":"Jinuk","family":"Kim","sequence":"additional","affiliation":[{"name":"Department of Computer Science and Engineering, Hanyang University, Seoul, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4675-5535","authenticated-orcid":false,"given":"Muhammad Adil","family":"Ansari","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering, Quaid-e-Awam University of Engineering Science and Technology, Larkana, Pakistan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2322-232X","authenticated-orcid":false,"given":"Sungju","family":"Park","sequence":"additional","affiliation":[{"name":"Department of Computer Science and Engineering, Hanyang University, Seoul, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ICCV.2015.312"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1038\/nature21056"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1038\/nature16961"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2616357"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISCA.2016.32"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISCA.2016.30"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1145\/3079856.3080246"},{"key":"ref8","volume-title":"Nvidia Deep Learning Accelerator","year":"2018"},{"key":"ref9","volume-title":"AI-Chip","year":"2020"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1145\/3195970.3196129"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/MDAT.2019.2947271"},{"key":"ref12","first-page":"1","article-title":"Sensitivity based error resilient techniques for energy efficient deep neural network accelerators","volume-title":"Proc. 56th Annu. Design Autom. Conf.","author":"Choi"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ASP-DAC47756.2020.9045479"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2004.85"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2009.2034764"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2014.2333332"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1145\/1391469.1391694"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2012.2202930"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/VTS.2018.8368656"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/JETCAS.2019.2933862"},{"key":"ref21","volume-title":"The Price Tag of Automotive Electronics: What\u2019s Really at Play?","author":"Mathas","year":"2020"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/ITC44170.2019.9000133"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/T-C.1973.223651"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TC.1976.5009199"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.1986.1270228"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/ESSCIRC.1985.5468108"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1145\/3061639.3062240"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/ITC-Asia.2019.00024"},{"key":"ref29","article-title":"Enabling DFT and fast silicon bring-up for massive AI chip\u2014Case study","volume-title":"Int. Test Conf","author":"Lau"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2007.1002"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2016.7417916"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2019.8780332"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/43\/9832686\/09530455.pdf?arnumber=9530455","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,11]],"date-time":"2024-01-11T22:55:19Z","timestamp":1705013719000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9530455\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,8]]},"references-count":32,"journal-issue":{"issue":"8"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2021.3110739","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"value":"0278-0070","type":"print"},{"value":"1937-4151","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022,8]]}}}