{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T10:00:53Z","timestamp":1740132053274,"version":"3.37.3"},"reference-count":40,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"10","license":[{"start":{"date-parts":[[2022,10,1]],"date-time":"2022-10-01T00:00:00Z","timestamp":1664582400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2022,10,1]],"date-time":"2022-10-01T00:00:00Z","timestamp":1664582400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,10,1]],"date-time":"2022-10-01T00:00:00Z","timestamp":1664582400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"NSF of China","doi-asserted-by":"publisher","award":["62071131","61771149","U2001203","61871136"],"award-info":[{"award-number":["62071131","61771149","U2001203","61871136"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003453","name":"NSF of Guangdong Province","doi-asserted-by":"publisher","award":["2019A1515011465"],"award-info":[{"award-number":["2019A1515011465"]}],"id":[{"id":"10.13039\/501100003453","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100012540","name":"Guangdong Innovative Research Team Program","doi-asserted-by":"publisher","award":["2014ZT05G157"],"award-info":[{"award-number":["2014ZT05G157"]}],"id":[{"id":"10.13039\/100012540","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001691","name":"Japan Society for the Promotion of Science through the Grant-in-Aid for Scientific Research","doi-asserted-by":"publisher","award":["20K04493"],"award-info":[{"award-number":["20K04493"]}],"id":[{"id":"10.13039\/501100001691","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2022,10]]},"DOI":"10.1109\/tcad.2021.3123288","type":"journal-article","created":{"date-parts":[[2021,10,26]],"date-time":"2021-10-26T20:45:18Z","timestamp":1635281118000},"page":"3438-3451","source":"Crossref","is-referenced-by-count":1,"title":["Achievable-Rate-Aware Retention-Error Correction for Multi-Level-Cell NAND Flash Memory"],"prefix":"10.1109","volume":"41","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-9483-5276","authenticated-orcid":false,"given":"Yingcheng","family":"Bu","sequence":"first","affiliation":[{"name":"School of Information Engineering, Guangdong University of Technology, Guangzhou, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-1538-249X","authenticated-orcid":false,"given":"Yi","family":"Fang","sequence":"additional","affiliation":[{"name":"School of Information Engineering, Guangdong University of Technology, Guangzhou, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9557-2444","authenticated-orcid":false,"given":"Guohua","family":"Zhang","sequence":"additional","affiliation":[{"name":"School of Communications and Information Engineering, Xi’an University of Posts and Telecommunications, Xi’an, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7771-2132","authenticated-orcid":false,"given":"Jun","family":"Cheng","sequence":"additional","affiliation":[{"name":"Department of Intelligent Information Engineering and Science, Doshisha University, Kyoto, Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2012.2185930"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.23919\/DATE48585.2020.9116263"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISVLSI.2012.82"},{"key":"ref4","article-title":"DeepNVM++: Cross-layer modeling and optimization framework of non-volatile memories for deep learning","volume-title":"arXiv:2012.04559","author":"Inci","year":"2020"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2017.2716958"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2019.2912228"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.7873\/DATE.2013.266"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA.2015.7056062"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2017.2713127"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TIT.2018.2884210"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2019.2954398"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TVT.2021.3106053"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JSAC.2020.3020603"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2018.2875311"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2017.2783438"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/LCOMM.2019.2915223"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/LCOMM.2018.2814985"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2017.2694613"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TITS.2021.3122994"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TCOMM.2020.2974723"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2019.2897223"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2010.2071990"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TCOMM.2016.2533498"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/MSST.2015.7208279"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2015.2453369"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2018.2858771"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/NVMSA.2015.7304359"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2017.2714902"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TSP.2012.2222399"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/TSP.2013.2295056"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1587\/elex.14.20170820"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2010.2046966"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2013.2244361"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/TCOMM.2010.01.060685"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/TIT.2016.2543740"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/JSAC.2014.140508"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/COMST.2015.2436705"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/COMST.2018.2797875"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/ICCRD.2011.5764084"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1109\/LCOMM.2016.2617309"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/43\/9895338\/09586047.pdf?arnumber=9586047","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,11]],"date-time":"2024-01-11T22:29:08Z","timestamp":1705012148000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9586047\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,10]]},"references-count":40,"journal-issue":{"issue":"10"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2021.3123288","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"type":"print","value":"0278-0070"},{"type":"electronic","value":"1937-4151"}],"subject":[],"published":{"date-parts":[[2022,10]]}}}