{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,1]],"date-time":"2026-04-01T08:24:52Z","timestamp":1775031892460,"version":"3.50.1"},"reference-count":41,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"10","license":[{"start":{"date-parts":[[2022,10,1]],"date-time":"2022-10-01T00:00:00Z","timestamp":1664582400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2022,10,1]],"date-time":"2022-10-01T00:00:00Z","timestamp":1664582400000},"content-version":"am","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2022,10,1]],"date-time":"2022-10-01T00:00:00Z","timestamp":1664582400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,10,1]],"date-time":"2022-10-01T00:00:00Z","timestamp":1664582400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100000001","name":"National Science Foundation","doi-asserted-by":"publisher","award":["CCF-1813370"],"award-info":[{"award-number":["CCF-1813370"]}],"id":[{"id":"10.13039\/100000001","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100000001","name":"National Science Foundation","doi-asserted-by":"publisher","award":["CCF-2006788"],"award-info":[{"award-number":["CCF-2006788"]}],"id":[{"id":"10.13039\/100000001","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100000001","name":"National Science Foundation","doi-asserted-by":"publisher","award":["CNS-2046226"],"award-info":[{"award-number":["CNS-2046226"]}],"id":[{"id":"10.13039\/100000001","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2022,10]]},"DOI":"10.1109\/tcad.2021.3132555","type":"journal-article","created":{"date-parts":[[2021,12,3]],"date-time":"2021-12-03T20:29:46Z","timestamp":1638563386000},"page":"3359-3372","source":"Crossref","is-referenced-by-count":34,"title":["Silicon Photonic Microring Resonators: A Comprehensive Design-Space Exploration and Optimization Under Fabrication-Process Variations"],"prefix":"10.1109","volume":"41","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-1813-7710","authenticated-orcid":false,"given":"Asif","family":"Mirza","sequence":"first","affiliation":[{"name":"Department of Electrical and Computer Engineering, Colorado State University, Fort Collins, CO, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3619-1465","authenticated-orcid":false,"given":"Febin","family":"Sunny","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering, Colorado State University, Fort Collins, CO, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Peter","family":"Walsh","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering, Colorado State University, Fort Collins, CO, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5518-8229","authenticated-orcid":false,"given":"Karim","family":"Hassan","sequence":"additional","affiliation":[{"name":"University Grenoble Alpes, CEA, Leti, Grenoble, France"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0846-0066","authenticated-orcid":false,"given":"Sudeep","family":"Pasricha","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering, Colorado State University, Fort Collins, CO, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4930-2985","authenticated-orcid":false,"given":"Mahdi","family":"Nikdast","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering, Colorado State University, Fort Collins, CO, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1364\/OE.18.019055"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JPHOT.2017.2662480"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1007\/s11431-012-5112-2"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/MDAT.2020.2982628"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1002\/lpor.201100017"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/MWSCAS.2015.7282035"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JLT.2018.2821359"},{"key":"ref8","first-page":"289","article-title":"SOI thickness uniformity improvement using wafer-scale corrective etching for silicon nano-photonic device","volume-title":"Proc. IEEE Photon. Soc.","author":"Selvaraja"},{"key":"ref9","first-page":"115","article-title":"Modeling fabrication non-uniformity in chip-scale silicon photonic interconnects","volume-title":"Proc. IEEE\/ACM Design Autom. Test Europe Conf. Exhibit.","author":"Nikdast"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSTQE.2019.2906271"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/SCORED.2017.8305385"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JLT.2017.2781131"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JLT.2015.2510282"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/JLT.2016.2563781"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/PS.2007.4300747"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1364\/OE.18.023598"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JLT.2021.3079801"},{"key":"ref18","volume-title":"Ansys Lumerical"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/GROUP4.2018.8478733"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1117\/12.876807"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/JPHOT.2011.2140367"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1364\/AO.52.007638"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1364\/oe.25.009712"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/DAC18072.2020.9218608"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/OIC.2019.8714437"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/LPT.2016.2544138"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1364\/OFC.2014.Th2A.55"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.23919\/DATE48585.2020.9116201"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/IPC47351.2020.9252537"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1364\/AO.16.000113"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1017\/CBO9781316084168"},{"key":"ref32","first-page":"1","article-title":"Photonic integrated circuits: A study on process variations","volume-title":"Proc. IEEE\/OSA Opt. Fiber Commun. Conf.","author":"Nikdast"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/JLT.2015.2503120"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/JLT.2016.2588459"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/LPT.2006.886974"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1088\/2040-8978\/16\/5\/055502"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.3390\/app8071139"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1364\/ol.43.001586"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1364\/OE.22.004547"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1002\/lpor.201800275"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1109\/DAC18074.2021.9586161"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"https:\/\/ieeexplore.ieee.org\/ielam\/43\/9895338\/9634115-aam.pdf","content-type":"application\/pdf","content-version":"am","intended-application":"syndication"},{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/43\/9895338\/09634115.pdf?arnumber=9634115","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,1]],"date-time":"2024-03-01T20:10:43Z","timestamp":1709323843000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9634115\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,10]]},"references-count":41,"journal-issue":{"issue":"10"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2021.3132555","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"value":"0278-0070","type":"print"},{"value":"1937-4151","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022,10]]}}}