{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,21]],"date-time":"2026-01-21T10:27:55Z","timestamp":1768991275113,"version":"3.49.0"},"reference-count":37,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"2","license":[{"start":{"date-parts":[[2023,2,1]],"date-time":"2023-02-01T00:00:00Z","timestamp":1675209600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2023,2,1]],"date-time":"2023-02-01T00:00:00Z","timestamp":1675209600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,2,1]],"date-time":"2023-02-01T00:00:00Z","timestamp":1675209600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100012166","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","award":["2019YFB2205005"],"award-info":[{"award-number":["2019YFB2205005"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62034007"],"award-info":[{"award-number":["62034007"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2023,2]]},"DOI":"10.1109\/tcad.2022.3176545","type":"journal-article","created":{"date-parts":[[2022,5,19]],"date-time":"2022-05-19T16:27:10Z","timestamp":1652977630000},"page":"544-557","source":"Crossref","is-referenced-by-count":12,"title":["Multilayer Perceptron-Based Stress Evolution Analysis Under DC Current Stressing for Multisegment Wires"],"prefix":"10.1109","volume":"42","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-5349-1825","authenticated-orcid":false,"given":"Tianshu","family":"Hou","sequence":"first","affiliation":[{"name":"Department of Micro\/Nano Electronics, Shanghai Jiao Tong University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8439-876X","authenticated-orcid":false,"given":"Peining","family":"Zhen","sequence":"additional","affiliation":[{"name":"Department of Micro\/Nano Electronics, Shanghai Jiao Tong University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3026-0108","authenticated-orcid":false,"given":"Ngai","family":"Wong","sequence":"additional","affiliation":[{"name":"Department of Electrical and Electronic Engineering, The University of Hong Kong, Hong Kong"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5174-8762","authenticated-orcid":false,"given":"Quan","family":"Chen","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Southern University of Science and Technology, Shenzhen, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8655-3487","authenticated-orcid":false,"given":"Guoyong","family":"Shi","sequence":"additional","affiliation":[{"name":"Department of Micro\/Nano Electronics, Shanghai Jiao Tong University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1281-0484","authenticated-orcid":false,"given":"Shuqi","family":"Wang","sequence":"additional","affiliation":[{"name":"Department of Micro\/Nano Electronics, Shanghai Jiao Tong University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7046-3455","authenticated-orcid":false,"given":"Hai-Bao","family":"Chen","sequence":"additional","affiliation":[{"name":"Department of Micro\/Nano Electronics, Shanghai Jiao Tong University, Shanghai, China"}]}],"member":"263","reference":[{"key":"ref1","first-page":"464","article-title":"Circuit design challenges at the 14nm technology node","volume-title":"Proc. ACM\/IEEE Des. Autom. Conf.","author":"Warnock"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/T-ED.1969.16754"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1063\/1.322842"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2017.2666723"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2020.2994271"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2015.7059030"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1145\/2744769.2747953"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2015.2508447"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1063\/1.354073"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1145\/2593069.2593180"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2016.2524540"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1145\/2966986.2967083"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2016.2523898"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2017.2746660"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2019.2940197"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1016\/j.neucom.2020.02.015"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1016\/j.jcp.2018.08.029"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1002\/cnm.1640100303"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/72.870037"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/72.712178"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1016\/j.jcp.2018.10.045"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1016\/j.jcp.2019.109020"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1016\/j.jcp.2020.109409"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.23919\/DATE51398.2021.9474231"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2022.3166103"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1201\/9781003364948-18"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2020.2981628"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2014.2301458"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2008.2011642"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1063\/1.3309744"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1557\/JMR.2000.0259"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1063\/1.2970171"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1016\/0893-6080(89)90020-8"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2018.2800707"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1137\/0916069"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2008.4483978"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1016\/j.jcp.2019.05.024"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/43\/10021949\/09778247.pdf?arnumber=9778247","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,1,20]],"date-time":"2026-01-20T20:40:19Z","timestamp":1768941619000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9778247\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,2]]},"references-count":37,"journal-issue":{"issue":"2"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2022.3176545","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"value":"0278-0070","type":"print"},{"value":"1937-4151","type":"electronic"}],"subject":[],"published":{"date-parts":[[2023,2]]}}}